EDICON China 2020会议指南 Conference Guide

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联袂举办“化合物半导体先进应用大会

目 录

全体会议主旨演讲
O-RAN或白盒子的神话与事实;Myths and Facts of O-RAN or Whitebox
5G/6G市场和技术概览;5G/6G Market and Technologies Overview
5G演进–从标准走向现实;5G evolution – from standards to reality

5G中的校准难题;Calibration Challenges in 5G
一种具有数字预失真功能的新型调制快速负载牵引系统;A Novel Modulated Rapid Load Pull System with Digital Pre-Distortion Capabilities
一种利用测向冗余解的平面双站时差导航方法;Two-station navigation method
信号完整性测量中的校准和去嵌;De-Embedding Method Analysis for Signal Integrity Measurement
封装天线:从传导到OTA,以及维持校准功率测量的要求;Antenna in Package: From conducted to OTA and the requirement to maintain calibrated power measurements
北美和欧洲的无线产品认证;Wireless Product Approval for North America and Europe
为中端和高端智能手机提供天线灵活性和高性能;Providing Antenna Flexibility and Performance across Mid-Tier and High-Tier Smartphone Architectures
基于可重构电路的电磁反演工具的仿真研究;Simulated results of an electromagnetic inversion tool based on reconfigurable electrical circuits
基于阶跃响应计算的抖动分解新方法;New Approach for Jitter Decomposition based on Step Response Calculation
学习如何设计5G/6G毫米波波束赋形系统;Learn How to Design a 5G/6G mmWave Beamforming System
用于汽车雷达系统仿真的多射线追踪复杂环境建模;Multiple Ray Tracing Complex Environment Modeling for Automotive Radar System Simulation
EDICON创新产品奖颁奖
USB 3.1 Type-C连接的信号完整性和一致性测试;Signal Integrity and Compliance Test of USB 3.1 Type-C Interconnect
使用天线增强器设计物联网设备;Design of IoT devices with Antenna Boosters
开放射频接入网的前行之路;O-RAN - The Path Forward
输出功率及其影响因素;Output power and what's behind it
5G相比4G,在V2X的射频、协议、应用场景方面可改进参数;5G vs 4G: improve the parameters in terms of V2X radio frequency, protocol, and application scenarios
5G车联网技术与测试;5G V2X technologies and testing
引领未來的GaN SiC射频技术;Leading the future GaN SiC RF technology
频率高达50GHz的高效表面贴装封装;Cost Effective Surface-mount Packaging to 50 GHz
北美和欧洲的无线产品认证(2);Wireless Product Approval for North America and Europe(2)
P-1dB是什么?确定放大器性能;What does P-1dB mean? Defining amplifier performance
新功率测量技术满足当今苛刻的射频和放大器的需求;New Power Measurement Techniques for Today's Demanding RF World and Faster Power Serving for Amplifiers
毫米波波束形成设备的设计与应用;Design and Application of millimeter-wave beamforming box
测试EV和EVSE充电接口的一致性和互操作性;Testing Conformance & Interoperability of EV and EVSE Charging Interfaces
茶歇和抽奖
下一代高速高性能测试;Next generation for unseen speed in high performance test
为分析物联网设备高效捕获波形;Efficient Capture of Waveforms for IoT Device Analysis
带宽与无线通信系统;Bandwidth and Wireless Communication Systems
如何根据应用评估和选择合适的电缆组件;How to evaluate and select the suitable cable assemblies based on the applications
中国市场的无线产品认证;Wireless Product Approval for China Market
THz混频器和转换器的幅度和相位测量;Magnitude and phase measurements on mixers and converters in the THz range
具备深背部通孔的砷化镓集成无源器件的制作技术;Fabrication Technology of GaAs Integrated Passive Devices with Deep Backside Vias
最先进的毫米波GaN/Si MMIC;State of the art mmW GaN/Si MMICs
评估电-光-电连接系统的电气性能;Evaluate Electrical Performance in Electrical-Optical-Electrical Link Systems
5G信号分析仪中信道估计和跟踪算法分析;Analysis of channel estimation and tracking algorithm in 5G signal analyzer
5G功率放大器设计变化对射频电路材料的需求;Choosing High Frequency Materials for 5G Power Amplifier Optimum Performance
如何找到FPGA电源轨的飘忽不定的动态开关电流;How to Find the Elusive Dynamic Switching Current of Your FPGA Power Rail
针对现代无线应用的欧洲GaN/Si工艺;European GaN/Si process for modern wireless application
5G OTA测量系统与核心技术;5G OTA Measurement Systems and Key Technologies
为5G应用构建功率放大器设计框架;Building a Power Amplifier Design Framework for 5G Applications
功率放大器测试:从负载牵引到调制测试;Power Amplifier Test: from Load Pull to Modulated Test
调制失真:PNA的残留误差矢量幅度;Modulation Distortion: Residual Error Vector Magnitude with PNA
克服为5G无线通信配置山顶频谱监测系统的困难;Overcome the challenges for setting up the hilltop spectrum monitoring system for the 5G wireless communications
新功率测量技术满足当今苛刻的射频和放大器的需求;New Power Measurement Techniques for Today's Demanding RF World and Faster Power Serving for Amplifiers
用Virtuoso RF解决方案集成RFIC、RF模块设计以及签核流程;Integrated RFIC, RF Module Design, and Signoff Flow with Virtuoso RF Solution
欢迎晚宴
毫米波应用的技术趋势和基材解决方案;Technology trends and substrate solutions for millimeter wave applications
56G SerDes仿真最佳实践;Best Practices for 56G Serdes channel simulation
信号分析基础-1;Signal Analysis Fundamentals-1
在暗室内模拟电磁环境的方法;Methodology to emulate an electromagnetic environment in an anechoic chamber
5G设备的FCC和RED要求;FCC and RED Requirement for 5G Device
Ansys高频高速仿真最佳实践专场
Ansys Minerva的自动化DDR仿真管理实例;Cloud Based Automated DDR SI simulation management with Ansys Minerva
SSB相位噪声,概念和应用;SSB Phase Noise, Concepts, and Applications
信号分析基础-2;Signal Analysis Fundamentals-2
用于亚太赫兹大信号测量的功率控制和有源牵引的方法;A frequency scalable approach for power control and active tuning for sub-THz large-signal measurements
高引脚数芯片的先进去耦方案;Advanced decoupling scheme for high pin count silicon
咖啡时间和抽奖
电子产品EMC仿真最佳实践;Best practices for Electronic devices EMC Simulation
UWB 802.15.4/4z技术和测试挑战;UWB 802.15.4/4z Technologies and Test Challenges
电子束光刻技术制作0.15/0.1μm高功率GaAs pHEMT;Electron Beam Projection Lithography Based 0.15/0.1μm High Power GaAs pHEMT Process
纳入射频模块后,对用于四合一服务的FTTH-GPON系统的物理性能进行评估;Evaluation of the Physical Performance of an FTTH-GPON System for Quad Play Services After the Incorporation of an RF Module
5G设备的FCC和RED要求(2);FCC and RED Requirement for 5G Device(2)
针对射频和微波宽带信号产生改进测量完整性;Improve Measurement Integrity for RF and Microwave Wideband Signal Generation
Ansys在5G天线仿真方面的关键技术更新;The Next Generation of Phase Array Simulation with HFSS
一种智能电视2.4G WiFi吞吐量的测试方法;Test method for 2.4G WiFi throughput of smart TV
考虑射频输入功率的面声波滤波器的仿真;Simulation of SAW device considering RF input power
基于DDRx的SI/PI联合仿真;SI/PI Co-Simulation based on DDRx interface
现代通信系统中天线阵列与非线性射频前端耦合效应的建模与仿真;Modeling and Simulation of Coupled Effects Between Antenna Arrays and Nonlinear RF Front Ends in Modern Communication Systems
Ansys HFSS车载雷达仿真最佳实践;Best practices for Ansys HFSS Vehicle Radar Simulation
以Virtuoso为中心的高级系统设计解决方案(高速和射频设计);Virtuoso Centric Advanced System Design Solution (High-Speed and RF Design)
基于ADI ADRV902X的5G Small Cell RU的参考方案;A 5G Small Cell RU reference design based on ADI ADRV902X
射频功率放大器的效率提升;Efficiency enhancements for RF power amplifiers
电源电流评估和电热协同设计;Current Flow Evaluation of Power Supply and Coordinated Design of Electric-Thermal
电磁干扰分析和故障查找;EMI Interference Analysis and Trouble Shooting
EMC合规测试最重要的事情;Most Important Thing for EMC Testing for Regulation
应用于无线通信的化合物器件服务;Compound technology service for wireless communication application
IR Drop中的设计细节,包括载流量和电热混合协同设计;Design Detail in IR Drop including Current carrying capacity and Electrothermal hybrid collaborative design
功率放大器测试:从负载牵引到调制测试;Power Amplifier Test: from Load Pull to Modulated Test
智能手机设计中的射频前端精确仿真面临的挑战;Challenges for RF Front End Accurate Simulation in Smart Phone Design
输入-输出波形控制的连续逆F类功率放大器的研究;Investigation of Input-Output Waveform Engineered Continuous Inverse Class F Power Amplifiers
网络分析仪基础;Network Analyzer Fundamentals
ADI新一代射频集成收发芯片ADRV902X介绍;Introduction of ADI new RF transceiver product ADRV902X
SBW> 200 MHz时线性化功率放大器;Linearizing PA at SBW > 200 MHz
高速串行总线的布局细节仿真和测试;Layout detail simulation and testing for High-Speed serial bus
基于ADI ADRV902X的5G Small Cell RU的参考方案;A 5G Small Cell RU reference design based on ADI ADRV902X
多芯片集成DDR颗粒的设计与仿真实践;Design and Simulation Practice of Multi-die Integrated DDR Particles
用于物联网的雷达技术;Radar Technology for IoT Applications
频率高达50GHz的高效表面贴装封装;Cost Effective Surface-mount Packaging to 50 GHz
相位噪声应用与测量基础;Phase Noise Basics Applications & Measurements
高效GaN多尔蒂功率放大器设计;High Efficiency GaN Doherty Power Amplifier Design
EMC合规测试最重要的事情(2);Most Important Thing for EMC Testing for Regulation(2)
ADI新一代射频集成收发芯片ADRV902X介绍;Introduction of ADI new RF transceiver product ADRV902X
P-1dB是什么?确定放大器性能;What does P-1dB mean? Defining amplifier performance
PCB测量中几种去嵌入方法的比较;Comparison of several de-embedding methods in PCB measurement
智慧城市的物联网和无线技术;IoT and Wireless Technologies for Smart Cities
低损耗介电材料测量;Low Loss Dielectric Materials Measurement
抽奖

Keysight Education Forum

5G中的校准难题;Calibration Challenges in 5G

Tuesday, Oct 13, 2020, 9:00 AM - 9:30 AM, Room 401

Speaker(s): Jian Lu

校准对不同的工程师意味着不同的事情。本演讲将探讨为什么校准质量至关重要,以及随着向更高频率、更宽带宽和无传导测量的转移,校准质量在5G应用中变得越来越重要。我们将研究在5G设备测试期间,如何将测量不确定性和保护带作为重要考虑因素,以确保您最大化吞吐量和良率,同时最大程度地降低测试成本。这可能涉及确保使用正确的测试设备、更改测试方法以及确保对测试设备进行正确的校准。

Calibration means different things to different engineers. This presentation will look at why calibration quality matters and how it has become more important in 5G applications with the move to higher frequencies, wider bandwidths and Over the Air measurements. We will look at how, during testing of 5G devices, measurement uncertainty and guard bands can be important considerations to ensure you maximize throughput and yield while minimizing cost of test. This could involve ensuring you are using the correct test equipment, changing test methodology and also ensuring the correct calibration of your test equipment.

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Technical Session

一种具有数字预失真功能的新型调制快速负载牵引系统;A Novel Modulated Rapid Load Pull System with Digital Pre-Distortion Capabilities

Tuesday, Oct 13, 2020, 9:00 AM - 9:30 AM, Room 406

Speaker(s): Ouyang Sihua,SENIOR FIELD APPLICATION ENGINEER,Focus Microwaves

Vincent Mallette,Director of Sales and Business Development,Focus Microwaves Group

Zhou Yang,SENIOR FIELD APPLICATION ENGINEER,Focus Microwaves

Track(s): Test and Measurement

本文研究了针对工业标准调制信号的具有数字预失真(DPD)的市售调制阻抗合成和测量系统的并行操作。该系统用于表征10W GaN HEMT器件,并响应于以2 GHz为中心的10 MHz LTE信号,对信号带宽和失真带宽提供阻抗控制,并且能够快速实现目标反射系数,且误差小于-40dB(1%)。基于National Instruments(NI)PXi的表征系统被用于基于存储器的DPD算法。当以2.5W的平均输出功率输出到最佳负载时,该晶体管被偏置为AB类,并成功地线性化至优于-47.95dBc ACPR。分析表明,DPD校正后的ACPR轮廓与P1dB轮廓紧密对齐,从而确认了DPD而不是原始ACPR的目标峰值功率的相关性。同样,重要的是,达到了线性性能水平,例如,可满足用于商业部署的3GPP线性规范(45dBc),并演示了在设计过程的早期阶段如何组合使用这种调制的负载牵引系统和DPD来降低放大器设计的风险。

This paper investigates the concurrent operation of a commercially available, modulated impedance synthesis and measurement system with digital pre-distortion (DPD) for industry standard modulated signals. The system was used to characterize a 10W GaN HEMT device, and provide impedance control over signal and distortion bandwidths, in response to a 10 MHz LTE signal centred at 2 GHz, and was able to rapidly achieve target reflection coefficients with an error less than -40dB (1%). A National Instruments (NI) PXi based characterisation system was used to apply a commercially available memory-based DPD algorithm. The transistor was biased in class-AB and was successfully linearised to better than -47.95 dBc ACPR when delivering at 2.5W average output power into an optimum load. Interestingly, the analysis showed that the DPD corrected ACPR contours aligned closely with the P1dB contours, confirming the relevance of targeting peak-power for DPD, rather than raw ACPR. Also, and importantly, a level of linearity performance was achieved that meets for example, the 3GPP linearity specifications (45dBc) for commercial deployment, and demonstrates how this modulated load-pull system and DPD can be combined to de-risk an amplifier design at a very early stage in the design process.

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Technical Session

一种利用测向冗余解的平面双站时差导航方法;Two-station navigation method

Tuesday, Oct 13, 2020, 9:00 AM - 9:30 AM, 展厅会议室 Main Stage - Expo Hall

Speaker(s): Tao Yu,Researcher,China institute of aeronautical radio electronics

Track(s): Radar and Antenna

基于程差定位方程线性解的内在特性,通过构造虚拟双基三站定位系统,给出了一种近似估计舰船位置的双站时差导航方法。先由三站等距直线阵列各站点的测向解,以及各站点的目标到达角之间的中值关系,构造冗余方程组,并利用迭代的方法,给出了较为准确的的测向值。随后即可利用相邻程差之间的等差级数特性,求得虚拟双基三站定位系统的两个独立的虚拟程差值,由此就能利用平面程差定位线性解求得被导航目标的距离。

Dual-station navigation will be applied to automatic driving, production automation and other fields. It means that people can reduce the number of sensors and route detection planning with fewer sites. Based on the linear solution of the existing planar path differential positioning equation, this paper studies how to realize dual station navigation under the condition that only the path difference between two stations and the baseline length is known. Firstly, a one-dimensional equidistant double-base array is constructed based on the dual navigation stations. Then, by using plane geometry relation and positioning equation, the azimuth angle of the target relative to the midpoint in the virtual double-base array is solved by using the redundant calculation. Thus, the tolerance of the arithmetic sequence of the path difference of the double-base array can be solved. Then, two virtual path differences corresponding to the virtual three-station linear array positioning system are obtained. This means that two independent positioning equations are obtained to satisfy two-dimensional plane positioning.

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Technical Session

信号完整性测量中的校准和去嵌;De-Embedding Method Analysis for Signal Integrity Measurement

Tuesday, Oct 13, 2020, 9:00 AM - 9:30 AM, Room 405

Speaker(s): kaisheng hu,Senior Engineer, Signal and Power Integrity,Ciena

Track(s): Signal Integrity

在信号完整性 (SI) 测试中,为了用网络分析仪精确测出待测件的S参数,各种校准和去嵌方法被广泛用于去除夹具或探头的影响,TRL和 2 x Thru 是常用的两种校准方法。我们用3D EM 仿真设计了SI测试板来比较这两种方法。在DC 至50 GHz 频率范围内,校准结果基本一致。但TRL呈现出了其固有的因果性问题。2 x Thru 被用于测试芯片至电路板射频链接,电路板带状线参数提取(Dk, Df 与表面粗糙度)。结果均满足设计指标。

In this paper, one calibration test PCB board is used to evaluate several different calibration and de-embedding methods: traditional TRL (Thru-Reflect-Line), Ataitec ISD and Keysight AFR. The DUT result from those three methods are quite close, for frequency range of DC to 50 GHz. While TRL shows non-causality issue and higher error at phase delay. Finally ISD and AFR are used to evaluate several typical scenarios of Signal Integrity: Transmission line and PCB parameter extraction (Dk, Df and surface roughness); RF transition between chip BGA package to PCB; 0402 RF broadband resistor evaluation. The results from 2X Thru meet our SI requirement with good de-embedding quality

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Technical Session

封装天线:从传导到OTA,以及维持校准功率测量的要求;Antenna in Package: From conducted to OTA and the requirement to maintain calibrated power measurements

Tuesday, Oct 13, 2020, 9:00 AM - 9:30 AM, Room 403

Speaker(s): Markus Loerner,Market Segment Manager for RF & Microwave Component Test,Rohde & Schwarz

Xiao Duan,System Product Manager,Rohde & Schwarz

Track(s): Front End Design

波束成形无处不在:雷达、卫星链路和5G,甚至在两个链路方向上也是如此。随着频率的上升,天线的尺寸在减小,集成度是实现高效的RF前端的关键因素。因此,现代设备将天线作为其唯一的RF接口。所有性能测量必须通过空中接口(OTA)进行,这需要测量天线。性能测试系统需要整个链路上经过校准的工具。今天,校准是通过传导完成的,但是OTA和校准后的功率测量又如何呢? 为了在任何OTA系统中实现绝对电平精度,必须使用校准天线。

车载雷达的发射功率越高,效果越好。但法规限制了最大输出功率。如果能接近极限则可具备竞争优势。类似的情况也适用于5G等其他系统。

Beam forming is everywhere: Radar, satellite links and 5G, even in both link directions. As frequencies are going up, antenna dimensions are going down and integration is a key enabler to allow cost efficient RF frontends. Thus, modern devices have antennas as their only RF interface. All performance measurements must be over the air (OTA) which require measurement antennas. Performance test systems require calibrated tools across the complete chain. Today, calibrations are done conducted, but how about OTA and calibrated power measurements? Calibrated antennas are mandatory for absolute level accuracy in any OTA system.

Automotive radar are more effective the higher the transmit power. Regulations limit the maximum output power. Getting closer to the limit gives a competitive advantage. Similar applies for other systems like 5G.

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ACB Training

北美和欧洲的无线产品认证;Wireless Product Approval for North America and Europe

Tuesday, Oct 13, 2020, 9:00 AM - 10:30 AM, Room 407

Speaker(s): Steven Yang,Manage of China branch of Washington Laboratories Ltd.

在国际市场中,您通常已经做好了一切准备:金钱,人才,产品甚至客户,但是您仍然缺乏通向国际市场的通行证。长期以来,国际认可使许多国内制造商一头雾水,从而失去了进入国际市场的机会。实际上,这并非遥不可及,在本次演讲中,我会让您知道如何解决这些问题。

In the tide of the international market, you often have everything ready: money, talent, products and even customers, but you still lack the passport to the international market -- International Approve. For a long time, international approve makes many domestic manufacturers at a loss, and thus lost the opportunity to enter the international market. In fact, all this is not out of reach, with this talk, I’ll let you know how to solve those problems.

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Technical Session

为中端和高端智能手机提供天线灵活性和高性能;Providing Antenna Flexibility and Performance across Mid-Tier and High-Tier Smartphone Architectures

Tuesday, Oct 13, 2020, 9:30 AM - 10:00 AM, Room 403

Speaker(s): Steve Hsieh,product marketing manager,Qorvo

Track(s): Front End Design

我们描述了一种将蜂窝和连接性(WiFi,GPS)RF链路相结合的方法,该方法可提供设计灵活性和高性能,以适应电话外形尺寸的变化,同时共享相似的天线架构。随着5G的引入以及智能手机中添加更多频段,天线的结构、位置和面积变得越来越复杂。快速变化的客户需求导致开发时间非常短,并且需要很大的设计灵活性。制造商需要快速适应不同地区和客户的手机RF链路和天线,但他们试图通过仅包括特定SKU所需的RF组件来最大程度地降低手机成本。

We describe an approach to combine cellular and connectivity (WiFi, GPS) RF paths that provides the design flexibility and performance required to address variants of phone form factors while sharing similar antenna architectures. With the introduction of 5G and more connectivity bands being added to smartphones, the antennas design, location and area are becoming increasingly complex. Fast changing customer requirements lead to very short development timelines and the need for great design flexibility; manufacturers need to rapidly adapt handset RF routing and antennas for different regions and customers, yet they seek to minimize handset cost by including only the RF components needed for the specific SKUs.

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Technical Session

基于可重构电路的电磁反演工具的仿真研究;Simulated results of an electromagnetic inversion tool based on reconfigurable electrical circuits

Tuesday, Oct 13, 2020, 9:30 AM - 10:00 AM, Room 406

Speaker(s): Jun Lu,Senior Scientific Engineer,Institute of Physics, Chinese Academy of Sciences

Track(s): Test and Measurement

仿真和反演问题是科学和工业研究中的普遍问题,例如大地电磁成像,无损测试,医学CT和使用电子显微镜确定显微组织。电磁反演问题通常使用软件或数字计算以及电磁仿真来处理,不过完全依赖数值计算的反演策略在较大规模问题中实时性较差,而具有模拟计算功能的直接硬件求解器对于解决大尺寸电磁问题可能提供一些不一样的思路。这项工作尝试使用可编程模拟电路解决电磁仿真和逆问题。研究发现电磁参数可以映射为电路的元素,其反演解决方案通过对电路网络的电路元件的自动调节与测量的不断交替进行来实现电路网络参数与被反演电磁系统的逐步逼近。通过实例仿真显示不同的电路网络,包括电阻、电容、电感以及不同的拓扑结构,均能够实现反演。新方法为模拟电路反演开辟了新的实现途径。

Simulation and inversion problems are a universal issue in scientific and industry research, such as magneto telluric imaging, non-destructive testing, medical CT, and microstructure determination using electro microscopy. Electromagnetic inversion problems are conventionally handled using software or digital calculation as well as electromagnetic simulation. It is understandable that direct hardware solver with analog calculation can be more promising for huge-size electromagnetic problems. This work is inspired by this idea and try to solve the electromagnetic simulation and inverse problem using programmable electrical circuit. It's found electromagnetic parameters can be mapped as elements of electric circuits and the solution can direct measurement of formation states of reconfigurable elements of circuit network. The uniqueness and stability of the novel process is also discussed.

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Technical Session

基于阶跃响应计算的抖动分解新方法;New Approach for Jitter Decomposition based on Step Response Calculation

Tuesday, Oct 13, 2020, 9:30 AM - 10:00 AM, Room 405

Speaker(s): Mathias Hellwig,Product Manager,Rohde & Schwarz

Wenhao Zhou,Product Manager,Rohde & Schwarz

Track(s): Signal Integrity

总抖动和噪声影响分析对于现代数据通信系统来说越来越重要。一方面,不断提高的数据速率,另一方面,板材、连接器等的成本压力,正是这种分析的驱动因素。市场上有几种商用产品,它们根据时间间隔误差(TIE)测量来分析抖动。使用TIE作为分析的基础有一些缺点,而要回答有关特定误码率(BER)下总抖动的最重要问题,则需要基于双重Dirac模型进行简化的估算。

本演讲提出了一种基于参数信号模型的新方法来分析和分解抖动。该模型的一个关键是阶跃响应的估计,它描述了传输系统的确定性行为。拟议的抖动和噪声分析框架考虑了输入信号中存在的所有信息。该框架依赖于模型参数的联合估计。与双重Dirac模型不同,所有相关的抖动和噪声贡献均来自该模型,并且以一致的形式表示。此外,该方法可以扩展到PAM信号的分析。

The analysis of contributions to the total jitter and noise is an increasingly important task for modern data communication systems. Increasing data rates on one hand and the cost pressure on board material, connectors, etc. on the other hand are driving factors for this analysis requirement.

There are several commercial products on the market, which analyze the jitter based on the time interval error (TIE) measurements. Using the TIE as a basis for the analysis shows several shortcomings, and answering the most important question about the total jitter at a certain bit error rate (BER) is left to a simplified estimation based on the dual Dirac model.

This presentation suggests a new method to analyze and decompose jitter based on a parametric signal model. One key to this model is the estimation of the step response, which describes the deterministic behavior of the transmission system. The proposed jitter and noise analysis framework takes all information present in the input signal into account. This framework relies on a joint estimation of model parameters. All relevant jitter and noise contributions are derived from the model, and are presented in a consistent form unlike the dual Dirac model. Furthermore the method can be extended to the analysis of PAM signals.

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Keysight Education Forum

学习如何设计5G/6G毫米波波束赋形系统;Learn How to Design a 5G/6G mmWave Beamforming System

Tuesday, Oct 13, 2020, 9:30 AM - 10:00 AM, Room 401

Speaker(s): Xindong Xue

在5G和6G通信系统中使用毫米波(mmWave)频率是研究界的常见话题,但是mmWave确实存在挑战。波束成形技术是有益的,但是控制和优化波束很困难。分析它们就更是如此。本次会议将演示基于模型的相控阵系统设计和仿真,以表征波束方向图。将使用前所未有的三维复合辐射图显示技术分析球面覆盖范围。

The use of millimeter-wave (mmWave) frequency for 5G and 6G communication systems is a common topic in the research community, but mmWave does have its challenges. Beamforming techniques are beneficial, but controlling and optimizing beams is difficult. Analyzing them is even more so. This session will demonstrate a model-based phased array system design and simulation to characterize a beam pattern. It will analyze spherical coverage using an unprecedented three-dimensional composite radiation pattern display technique.

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Technical Session

用于汽车雷达系统仿真的多射线追踪复杂环境建模;Multiple Ray Tracing Complex Environment Modeling for Automotive Radar System Simulation

Tuesday, Oct 13, 2020, 9:30 AM - 10:00 AM, 展厅会议室 Main Stage - Expo Hall

Speaker(s): Jin Zhang,Keysight EESof SystemVue Radar R&D,Keysight Technologies

Track(s): Radar and Antenna

除了5G之外,近年来ADAS和自动驾驶也成为热门话题。毫米波雷达是ADAS或自动驾驶系统传感器融合应用中的核心传感器之一,它可以在恶劣的天气条件下运行,并且成本相对低于其他传感器。因此,毫米波汽车雷达在未来将继续占据重要的市场份额。对于大多数雷达芯片组、模块和传感器融合算法研发工程师来说,汽车雷达仿真是一个巨大的挑战。面对复杂环境雷达系统级建模的困难,是德科技SystemVue提出了基于多射线追踪(MRT)方法的复杂场景建模工具,该工具可以与汽车雷达设计库无缝集成。MRT工具可以帮助用户使用内置目标模型生成自定义的3D雷达工作方案、配置MRT计算参数、预览和检查动态目标运动以及根据波形设置计算时间线和信号处理参数。然后,MRT将在逐个脉冲的基础上开始复合回波计算。MRT生成了一个文件(通常包括整个CPI的所有射线结果),并将其加载到已建立的SystemVue数据流信号处理示例中。该设计示例演示了系统级雷达设计,从定制波形开始,到天线阵列和方向图导入、MRT回波导入、接收器回波去啁啾,最后一直到信号和数据处理。在SystemVue平台中还建立了射频损伤建模功能。MRT的常见复杂场景回波结果是距离多普勒映射、点云峰值检测结果以及所有格式复杂的所有通道的接收器信号。利用这些信号和数据处理结果,用户可以分析模拟的雷达回波并与测试结果进行比较,或者直接将它们用于传感器融合算法的开发。

ADAS and autonomous driving have been hot topics in recent years besides 5G. mmW radar is one of the core sensors in sensor fusion applications for the ADAS or autonomous driving system, which can operate under harsh weather conditions and the costs are relatively lower than other sensors. Therefore, mmW automotive radar will continue to occupy significant market share in the future. Automotive radar simulation is a great challenge for most radar chipset, module and sensor fusion algorithm R&D engineers. Facing the difficulty for complex environment radar system-level modeling, Keysight SystemVue proposes the Multiple-Ray-Tracing (MRT) method based complex scenario modeling tool, which can be seamlessly integrated with the Automotive Radar Design library. The Multiple-Ray-Tracing (MRT) tool can help the user generate the customized 3D radar working scenario with built-in target models, configure the MRT calculation parameters, preview and check the dynamic target movements, and setup the calculation timelines according to waveform and signal processing parameters. Then, the MRT complex echo calculation will start on a pulse-by-pulse basis. MRT generated a file (usually including all the ray results across a total CPI) to be loaded in established SystemVue dataflow signal processing examples. The design example demonstrates the system-level radar design starting from customized waveform, to antenna array and pattern importing, MRT echo importing, receiver echo de-chirping and finally down to signal and data processing. RF impairment modeling capabilities are also established in SystemVue platform. The common complex scenario echo results for MRT are Range-Doppler mapping, point-cloud peak detection results, and receiver signal for all channels in complex format. With these signal and data processing results, the user could analyze the simulated radar echo and compare with the test results or directly use them for sensor fusion algorithm developments.

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Main Stage Presentation

EDICON创新产品奖颁奖/Product Innovation Awards

Tuesday, Oct 13, 2020, 10:00 AM - 10:30 AM, 展厅会议室 Main Stage - Expo Hall

Join us as we announce the third annual EDI CON CHINA Third Annual Innovation Award winners!

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Technical Session

USB 3.1 Type-C连接的信号完整性和一致性测试;Signal Integrity and Compliance Test of USB 3.1 Type-C Interconnect

Tuesday, Oct 13, 2020, 10:00 AM - 10:30 AM, Room 405

Speaker(s): Anil-Kumar Pandey,Principal RnD Engineer,Keysight Technologies

Track(s): Signal Integrity

本文旨在提供具有IBIS-AMI模型的下一代USB 3.1Type-C接口的信号完整性和一致性测试解决方案。USB Type-C连接器规范定义了与现有USB接口电气和功能规范兼容的新插座、插头和检测机制。USB Type-C连接满足连接器标准对USB 2.0到3.1、Thunderbolt、MHL、DisplayPort等的需求,可用于广泛的应用中。USB 3.1使最大数据传输速率从5 Gb/s翻了一番,达到10 Gb/s。对包括均衡器的USB互连进行瞬态仿真,以确保满足接口规范,包括小于指定最大值的误码率(BER)和眼图特性。USB Type-C遵循SERDES架构。SERDES是用于集成电路(IC)的高速串行数据链路,用于串行化并行数据并以更快的速率传输数据。千兆赫SERDES已成为高端计算设备中领先的板间和芯片间数据传输技术。IBIS-AMI模型用于高速串行接口的电路仿真。使用3D频域模拟器(FEM)估算数据总线和USB连接器的通道损耗。将结果与根据USB 3.1要求的接收眼罩进行比较,以满足幅度和抖动的令人惊讶的规格,然后将获得比规定的更好的BER(通常为12-17)。若干信号完整性损害会影响端到端链路性能:衰减、反射和串扰。合规性规范就是要管理这三个缺陷。对TX和RX电气以及完整的通道进行了合规性测试,以确保USB 3.1通道性能符合USB规范。

This paper is intended to provide signal integrity and compliance test solution of the next generation of USB 3.1 type-C interface with IBIS-AMI model. The USB Type-C connector specification defines a new receptacle, plug and detection mechanisms that are compatible with existing USB interface electrical and functional specifications. The USB Type-C connection addresses connector standards need for USB 2.0 through 3.1, Thunderbolt, MHL, DisplayPort and more, for use in a broad range of applications. USB 3.1 doubles the maximum data transfer rate from 5 Gb/s to 10 Gb/s. Transient simulation of USB interconnects including an equalizer is performed to ensure that the interface specifications are met, including the bit error rate (BER) that is less than a specified maximum and the eye characteristics. USB type-C follows SERDES architecture. SERDES is a high-speed serial data link used in integrated circuits (ICs) to serialize the parallel data and transfer it at a much faster rate. Gigahertz serialization and deserialization (SERDES) has become a leading inter-board and inter-chip data transmission technique in high-end computing devices. The IBIS-AMI model is used for circuit simulation of high-speed serial interfaces. A 3D frequency-domain simulator (FEM) was used to estimate the channel loss for the data bus and USB connector. Results are compared with received Eye Mask as per USB 3.1 requirement to meet the eye-opening specification for amplitude and jitter [7], then a better-than-specified BER (usually 12-17) would be achieved. Several signal-integrity impairments impact the end-to-end link performance: attenuation, reflection, and crosstalk. The compliance specification is all about managing these three impairments Compliances testing of TX and RX electrical as well as complete channel is done to ensure USB 3.1 channel performance are meeting USB specifications.

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Technical Session

使用天线增强器设计物联网设备;Design of IoT devices with Antenna Boosters

Tuesday, Oct 13, 2020, 10:00 AM - 10:30 AM, Room 403

Speaker(s): Aurora Andújar,Product and Business Development Manager, Co-Founder at Fractus Antennas

David Vye,Dir Technical Marketing,Cadence

JAUME ANGUERA,Chief Scientist and Co-Founder at Fractus Antennas; Associate Professor at Universitat Ramon Llull

Milton Lien,Regional Technical Manager,Cadence

Track(s): Front End Design

无线物联网设备的增加促进了射频/微波和无线工程师以简单、快速和高效的方式进行设计。从放大器、双工器、滤波器到前端模块,所有这些都应该易于集成,天线也不例外。为此,本文提出了一种基于非常简单的天线元件设计用于物联网设备的多频带天线系统的方法。这种简单的天线称为天线增强器,具有体积小(约为传统天线的十分之一)、多频段,有商品现货的特性,并与pick & place组装工艺兼容。采用该设计方法,频带的数量仅通过具有集总元件(电容器和电感器)的多频带匹配网络的设计来固定。多频带匹配网络的设计通过基于遗传算法的计算机程序来解决,从而给出匹配网络拓扑和每个集总元件的值。为了验证该过程,展示了工作在824MHz-960MMHz和1710-2690MHz的多频带天线系统。该示例中使用的天线增强器的尺寸很小,约为100mm3(在最低工作频率824MHz时,最大尺寸为l/ 30)。匹配网络是使用全自动方法获得的,无需人工干预,也无需任何调整。将自动设计方法与使用工程经验设计的天线系统进行比较,以确定所提出方法在设计时间和电磁性能(匹配损耗、效率)方面的优势。现在,设计多频带天线系统就像设计匹配网络一样简单。新一代的超小型天线增强器使天线不再需要定制。此过程为设计物联网设备的无线工程师打开了一个窗口,以促进多频带天线系统的设计。

The increase of wireless IoT devices boosts RF/microwave and wireless engineers to design in a simple, quick and effective way. From amplifiers, diplexers, filters, to front-end-modules all should be easy to integrate. And the antenna should not be an exception. For this purpose, a method for designing multiband antenna systems for IoT devices based on a very simple antenna element is proposed. This simple antenna is called an antenna booster featuring small size (about ten times less than conventional antennas), multiband performance, off-the-shelf, and compatible with pick & place assembly process. The design method results in a procedure where the number of bands is fixed exclusively by the design of a multi-band matching network with lumped elements: capacitors and inductors. The design of the said multiband matching network is addressed by a computerized procedure based on genetic algorithms giving, as a result, the matching network topology and the values of each lumped element. To validate the procedure, a multiband antenna system operating at 824MHz-960MMHz and 1710-2690MHz is shown. The antenna booster used for the example presents a small size of about 100mm3 (the maximum dimensions is l/30 at the lowest frequency of operation, 824MHz). The matching network is obtained using a fully automated method without human intervention and without any adjustment. The automated design method will be compared with an antenna system designed using engineering experience in order to determine the advantages of the proposed method in terms of design time and electromagnetic performance (matching losses, efficiency). Designing a multiband antenna system is now as simple as designing a matching network. The antenna does not longer need customization thanks to the new generation of tiny and off-the-shelf antenna boosters. This procedure opens a window to facilitate the design of multiband antenna systems to wireless engineers designing IoT devices.

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Keysight Education Forum

开放射频接入网的前行之路;O-RAN - The Path Forward

Tuesday, Oct 13, 2020, 10:00 AM - 10:30 AM, Room 401

Speaker(s): Blair Lee

开放式射频接入网(O-RAN)支持5G基础架构中射频接入网的转换和虚拟化。对于满足诸如物联网、工业4.0和汽车等新兴行业的需求,这一发展至关重要。参加我们的会议以了解O-RAN技术、其各种组件的测试要求以及相关的挑战。

Open Radio Access Network (O-RAN) enables the transformation and virtualization of the radio access network in 5G infrastructure. This development is essential to address the requirements from new industry verticals such as the Internet of Things, Industry 4.0, and automotive. Attend our session to learn about O-RAN technology, testing requirements for its various components, and associated challenges.

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Technical Session

输出功率及其影响因素;Output power and what's behind it

Tuesday, Oct 13, 2020, 10:00 AM - 10:30 AM, Room 406

Speaker(s): Frank Thümmler,Rohde & Schwarz

Peng Chen,Product Manager

Track(s): Test and Measurement

模拟信号发生器必须满足具有挑战性的要求,例如其信号纯度和精确的输出功率。

后者是本会议的重点。将介绍如何确保最高精度的输出功率,以及如何随时间、频率或温度的变化而稳定地输出功率。此外,您还将了解为什么电平重复性可能比绝对电平精度更为重要。对于特定应用,展示了不良VSWR的影响以及如何补偿外部设备的频率响应。

功率放大器的测量通常需要电平扫描。您将看到如何在宽动态范围内改变模拟信号发生器的输出功率,并要特别注意,在扫描时该信号不会中断。

An analog signal generator has to meet challenging requirements. Essential characteristic features are, for example, its signal purity and a precise output power.

The latter is the focus of this session. It will highlight how to ensure an output power with highest accuracy and how it is stabilized over time, frequency or temperature. In addition you will learn why the level repeatability might be even more important than the absolute level accuracy. For specific applications the influence of a bad VSWR and how to compensate frequency responses of external devices is shown.

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Plenary Keynote

O-RAN或白盒子的神话与事实;Myths and Facts of O-RAN or Whitebox

Tuesday, Oct 13, 2020, 11:00 AM - 11:30 AM, Room Auditorium

Speaker(s): Chih-Lin I,Chief Scientist, Wireless Technologies,China Mobile Research Institute

易芝玲博士将在演讲中讨论开放、智能的5G网络生态系统的好处。O-RAN针对的是整个5G生态系统,而不仅仅是某些应用或仅仅是硬件或软件。易博士将讨论O-RAN活动的时间表及其对测试/测量和设备设计的影响。

In this keynote, Dr. I will discuss the benefits of an open and smart ecosystem for 5G networks. O-RAN addresses the whole 5G ecosystem and not just certain applications or just hardware or software. Dr. I will discuss the timeline of O-RAN activities and their effect on test/measurement and device design.

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Plenary Keynote

5G/6G市场和技术概览;5G/6G Market and Technologies Overview

Tuesday, Oct 13, 2020, 11:30 AM - 12:00 PM, Room Auditorium

Speaker(s): Jifeng Zheng,General Manager of Greater China Marketing, Keysight Technologies

本演讲利用最新的市场数据总结了5G商业市场的进展,总结了5G行业供应链遇到的挑战,展望了未来5G后和6G技术的发展,并概述了是德科技端到端的5G测试解决方案产品组合,以及与行业合作伙伴的成功案例。

This session summarizes the progress of the 5G commercial market with the latest market data, summarizes the challenges encountered in 5G industry supply chain, looks at the development of beyond 5G and 6G technologies in the future, and outlines the Keysight Technology’s 5G end-to-end test solutions portfolios, as well as the successful stories with industry partners.

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Plenary Keynote

5G演进–从标准走向现实;5G evolution – from standards to reality

Tuesday, Oct 13, 2020, 12:00 PM - 12:30 PM, Room Auditorium

Speaker(s): 金海良 Jin Hailiang,产品与技术部高级总监, 罗德与施瓦茨(中国)科技有限公司 Senior Director - Product & Technology, Rohde & Schwarz (China) Technology Co., Ltd.

5G部署已经开始,R15之后的3GPP版本将继续发挥5G的巨大潜力。本演讲将概述5G将如何发展,并解释在组件、芯片组、用户设备和基站方面5G NR测试和测量面临的新挑战。

5G deployments have started, and 3GPP releases beyond R15 will continue to to tap into the tremendous potential of 5G. This talk will outline how 5G will evolve from where it is today and explain the new 5G NR test and measurement challenges – for components and chipsets, user devices and base stations.

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Technical Session

5G相比4G,在V2X的射频、协议、应用场景方面可改进参数;5G vs 4G: improve the parameters in terms of V2X radio frequency, protocol, and application scenarios

Tuesday, Oct 13, 2020, 1:30 PM - 2:00 PM, 展厅会议室 Main Stage - Expo Hall

Speaker(s): Li Yongdong,Technical Supervisor of ICR / AUT of Rohde & Schwarz (China) Technology Co., Ltd.

Track(s): 5G/Advanced Communications

移动通信的不断改进,推动了自动驾驶的发展。中国、欧洲,包括美国都确认使用V2X的方式来发展自动驾驶。V2X业务中存在着车对车通信(V2V)、车对物通信(V2I),车对人通信(V2P),车对网络通信(V2N)通信,我们统称为V2X通信。到了NR阶段,我们基本分为PC5接口和Uu接口,这样使通信实现更清晰。即对于V2X车载终端RSU来说,只有两种接口:与基站通信的Uu接口及与其他设备通信的PC5接口。其中包括与人的通信V2P,因为与人的通信,实际是与人的穿戴设备通信,因此同样归入V2X。因此,我们将从PC5、Uu的RF、协议、应用场景等方面入手来分析NR相对LTE,在V2X方面做了哪些改进。

The continuous improvement of mobile communications has promoted the development of autonomous driving. China, Europe, and the United States have all confirmed the use of V2X to develop autonomous driving. V2X business includes vehicle-to-vehicle communication (V2V), vehicle-to-object communication (V2I), vehicle-to-person communication (V2P), and vehicle-to-network communication (V2N) communication. We collectively call them V2X communication. At the NR stage, we basically divided into PC5 interface and Uu interface, so that the communication implementation is more clear. That is, for the V2X vehicle terminal RSU, there are only two interfaces: a Uu interface for communication with a base station and a PC5 interface for communication with other devices. This includes V2P. Because communication with people actually connects with people's wearable devices, it is also classified as V2X. Therefore, we will start from PC5, Uu's RF, protocol, application scenarios and other aspects to analyze NR compared to LTE, what improvements have been made in V2X.

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Keysight Education Forum

5G车联网技术与测试;5G V2X technologies and testing

Tuesday, Oct 13, 2020, 1:30 PM - 2:00 PM, Room 401

Speaker(s): Qian Zhou

无线通信有望为自动驾驶汽车提供更安全的驾驶和更多便利。C-V2X是车辆相互之间以及与周围所有物体进行通讯的基础。LTE-V(3GPP)和5G将实现V2X的愿景以及自动驾驶汽车的全部潜力。是德科技针对蜂窝车联网的测试和测量解决方案有助于加速对自动驾驶至关重要的无线技术产品的设计和制造。

Wireless communications promise to enable safer driving and more convenience for autonomous vehicles. C-V2X serves as the foundation for vehicles to communicate with each other and everything around them. LTE-V (3GPP) and 5G will realize the vision of V2X and the full potential of self-driving vehicles. Keysight’s test and measurement solutions for cellular vehicle-to-everything (C-V2X) help accelerate the design and manufacturing of wireless technologies critical to autonomous driving.

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Workshop

引领未來的GaN SiC射频技术;Leading the future GaN SiC RF technology

Tuesday, Oct 13, 2020, 1:30 PM - 2:00 PM, Room 403

Speaker(s): Wang Ziming,Wolfspeed

作为业界唯一垂直整合的GaN-SiC供应商,Cree/Wolfspeed致力于为客户提供从SiC晶圆到器件及系统端最优质的解决方案。这将为我们的客户带来具有领先性的GaN-SiC解决方案,稳定的供应以及最好的成本长期成本。

为了进一步降低客户设计的难度和成本,Cree/Wolfspeed 一直致力于为客户提供ADS和AWR最好的GaN仿真模型,这将进步帮助我们的客户做到一版满足需求。

同时,产品质量也是Cree/Wolfspeed 一直持续关注的重点,并在市场上得到客户们大量的积极评价。

As the only vertical integrated GaN-SiC supplier on the market, Cree/Wolfspeed had capability of providing optimized the solution from SiC material to device and system level. This gives our customer the best class of GaN-SiC solution, solid supply and the best cost structure.

To minimize our customer design effort and cost, Cree/Wolfspeed also had provide the best class of GaN device simulation module on both ADS and AWR, which will help our customer to get one-time design pass.

In the meanwhile, Cree/Wolfspeed is continuing focuses on device quality and had received very positive market feedback

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Workshop

频率高达50GHz的高效表面贴装封装;Cost Effective Surface-mount Packaging to 50 GHz

Tuesday, Oct 13, 2020, 1:30 PM - 2:00 PM, Room 405

Speaker(s): Yuon (Jonathan) Zhang,China Sales Manager ,MiniCircuits

使毫米波器件能够发挥最佳性能同时又比chip-and-wire制造工艺具有更好的组装坚固性的封装技术已经有数十年了。通常,这些封装基于高温共烧陶瓷或类似的低损耗、稳定的材料,可最大程度地减少寄生效应。但是,在满足性能要求的同时,这些技术历来非常昂贵,需要手动组装过程,并且不具备表面贴装功能。另一方面,低成本、塑料包覆成型封装已占据了大批量、低频表面贴装应用的主导地位。该封装技术系列非常适合低于10GHz的情形,但是在20GHz或更高频率下要获得可接受的性能已被证明是困难的。随着Mini-Circuits继续将其产品线从10GHz以下推向Ku、Ka和更高频段,我们基于增强的多物理场建模方法、制造技术和材料开发了一种更加集成的产品设计方法,将leadframe-based封装推向高达50GHz的频率。

Packaging technologies that enable mmW devices to perform at their best while providing better assembly robustness over chip-and-wire manufacturing have been around for decades. Often these packages are based on High Temperature Co-Fired Ceramic or similar low loss, stable materials that minimize parasitic degradation. However, while delivering on the performance requirements, these technologies have historically been very expensive, require manual assembly processes and have not been surface-mount capable. On the other end of the spectrum, low-cost, plastic overmolded packaging has dominated the high-volume, lower frequency surface-mount applications. This family of packaging technologies is extremely well suited for sub 10 GHz operation, but achieving acceptable performance at 20 GHz, or higher, has proven difficult. As Mini-Circuits continues to push its product lines from sub 10 GHz into Ku, Ka and higher frequency bands, we have developed a more integrated product design methodology, based on an enhanced multi-physics modeling methodology, manufacturing techniques and materials to push leadframe-based packaging up to 50 GHz

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ACB Training

北美和欧洲的无线产品认证(2);Wireless Product Approval for North America and Europe (part 2)

Tuesday, Oct 13, 2020, 1:30 PM - 2:30 PM, Room 407

Speaker(s): Steven Yang,Manage of China branch of Washington Laboratories Ltd.

在国际市场中,您通常已经做好了一切准备:金钱,人才,产品甚至客户,但是您仍然缺乏通向国际市场的通行证。长期以来,国际认可使许多国内制造商一头雾水,从而失去了进入国际市场的机会。实际上,这并非遥不可及,在本次演讲中,我会让您知道如何解决这些问题。

In the tide of the international market, you often have everything ready: money, talent, products and even customers, but you still lack the passport to the international market -- International Approve. For a long time, international approve makes many domestic manufacturers at a loss, and thus lost the opportunity to enter the international market. In fact, all this is not out of reach, with this talk, I’ll let you know how to solve those problems.

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Workshop

P-1dB是什么? 确定放大器性能;What does P-1dB mean? Defining amplifier performance

Tuesday, Oct 13, 2020, 2:00 PM - 2:30 PM, Room 405

Speaker(s): Yuon (Jonathan) Zhang,China Sales Manager,MiniCircuits

在RF电路设计领域中,经常引用一些定义,这些定义广泛用于描述电路性能,有时是理所当然的。人们还可以发现,这些定义是本着产品差异化的精神“延伸”的。尽管营销人员有时会使用它们来区分产品性能,但这些关键定义的非标准化用法通常会导致误解,并最终使客户感到沮丧。对于射频放大器,一个完善的关键性能指标是其额定输出功率。放大器的输出功率有时简单地称为“输出功率”,没有基准或参考,因此几乎不可能知道放大器在从线性工作范围到非线性工作范围时的行为。通常,额定功率被指定为压缩1、2或3 dB(P-1 dB,P-2 dB或P-3 dB)时的输出功率、饱和输出功率(PSat)或这些术语的某种组合。通常被过于简化的是,这些功率性能指标的基础在很大程度上取决于测量条件和被放大信号的性质。更重要的是,这些术语是相对的度量,取决于其他一些属性。对这些定义及其用法有共同的理解应该有助于工程师与其服务的客户之间的沟通。

In the domain of RF circuit design there are definitions that are often cited, used extensively in describing circuit performance, and sometimes taken for granted. One can also find that these definitions have been “stretched” in the spirit of product differentiation. Whilst sometimes used by marketeers for product performance differentiation, the non-standardized usage of these key definitions most often leads to miscommunication, misinterpretation and ultimately frustration for customers. For RF amplifiers, a well-established and key performance metric is its rated output power. Amplifier output power is sometimes given simply as “output power” with no basis or reference, making it nearly impossible to know how the amplifier behaves in its transition from linear to non-linear range of operation. Commonly the rated power is specified as output power at 1, 2 or 3 dB compression (P-1 dB, P-2 dB, or P-3 dB), saturated output power (PSat), or some combination of these terms. What is often oversimplified is that the basis for these power performance metrics depends strongly on the measurement conditions and the nature of the signal being amplified. More importantly, these terms are relative measures, which depend on some other performance attribute. Having a common understanding of these definitions and their use should provide a common language between engineers, and the customers they serve

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Workshop

新功率测量技术满足当今苛刻的射频和放大器的需求;New Power Measurement Techniques for Today's Demanding RF World and Faster Power Serving for Amplifiers

Tuesday, Oct 13, 2020, 2:00 PM - 2:30 PM, Room 403

Speaker(s): Jian Wang,Product Manager

Markus Loerner,Market Segment Manager for RF & Microwave Component Test,Rohde & Schwarz

功率传感器是每个RF和微波实验室的常用工具,它们提供非常精确的功率水平测量。但是,实现这些精确功率测量的技术也有一些局限性。由于传统功率传感器的宽带特性,无法进行窄带功率测量或低电平功率测量。

在进行特性分析或最终生产测试之前,经常需要为诸如RF功率放大器之类的有源组件设置目标输出功率。由于该设备可能不是预先知道的或高度非线性的,因此使用了一个闭环控制系统,该系统由输出处的测量设备和输入处的源组成。nested system将有助于以几个数量级的幅度加快测量过程,可以代替传统的仪器远程控制。

本文将传统功率传感器与新型频率选择性功率传感器进行比较,以确保您可以针对正在测试的任何信号进行正确的功率测量。

Power Sensors are a common tool around every RF and Microwave lab, they provide very accurate power level measurements. However, the technology that enables these accurate power measurements, also has some limitations. Making narrowband power measurements or low level power measurements is not possible due to the broadband nature of a traditional power sensors.

Active components such as RF power amplifiers often require to be set to a target output power before running characterization or final production test. As the device may not be known upfront or is highly nonlinear, a closed loop control system consisting of a measuring device at the output and a source at the input is used. Instead of a classic remote control of the instrumentation, a nested system will help speeding up the serving process by order of magnitudes.

The paper will compare traditional power sensors, with new frequency selective power sensors to ensure that you can make the right power measurement for whatever signal you are testing.

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Technical Session

毫米波波束形成设备的设计与应用;Design and Application of millimeter-wave beamforming box

Tuesday, Oct 13, 2020, 2:00 PM - 2:30 PM, 展厅会议室 Main Stage - Expo Hall

Speaker(s): Chueh-Jen Lin,Vice President,TMYTEK

Su-Wei Chang,Founder and President of TMYTEK

Track(s): 5G/Advanced Communications

5G时代即将来临。毫米波波段的超宽带宽使它成为新无线电(NR)频谱中最吸引人的频率。然而,高路径损耗成为最关键的问题,必须在利用该频带之前解决。天线阵列解决方案可以补偿路径损耗。与天线阵列一起,波束成形技术已被引入天线阵列以实现广泛的覆盖范围。波束成形电路包括移相器和可变衰减器,以通过控制不同的相位和幅度权重来执行波束控制和波束成形。在此文中,已经设计和制造了最灵活的毫米波波束成形开发工具,并以Beamformer Box(BBox)命名。BBox由两部分组成:天线套件(AA-Kit)和波束形成电路(Phi-A Box)。灵活的设计使天线设计人员和波束跟踪算法开发人员同时受益。据作者所知,BBox是全球第一个毫米波波束成形开发工具,可帮助所有5G毫米波开发人员大大加快其设计和研究速度。

5G era is on the way. The millimeter-wave band is the most attractive frequency in New Radio (NR) spectrum according to its ultra-wide bandwidth. Nevertheless, the high path loss becomes the most critical issue which must be solved before utilizing this frequency band. The antenna array came into the solution to compensate for the path loss. Along with the antenna array, beamforming technology has been introduced into the antenna array to achieve wide coverage. The beamforming circuit includes the phase shifters and variable attenuators to perform beam steering and beam shaping by controlling different phase and amplitude weight. In this proposal, the most flexible millimeter-wave beamforming developing tools has been designed and manufactured, which named with Beamformer Box (BBox). BBox has consisted of two parts: antenna Kit (AA-Kit) and beamforming circuit (Phi-A Box). The flexible design benefits the antenna designers and beam tracking algorithm developers simultaneously. To the best of the authors' knowledge, BBox is the first millimeter-wave beamforming developing tool in the worldwide and help all the 5G millimeter-wave developers dramatically speed up their design and research.

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Keysight Education Forum

测试EV和EVSE充电接口的一致性和互操作性;Testing Conformance & Interoperability of EV and EVSE Charging Interfaces

Tuesday, Oct 13, 2020, 2:00 PM - 2:30 PM, Room 401

Speaker(s): Jianming Yu

电动汽车(EV)及其基础设施(EVSE)的市场需求快速增长,并伴随着客户的期望。在过去两年中,即使超出相关原始充电标准(例如IEC 61851-23)的电气规范,新型EV的平均电池容量和最大DC充电功率也显著提高。作为EV或EVSE制造商,您如何在提高产品质量的同时缩短上市时间?到目前为止,电动汽车和供电设备的充电接口大部分都经过手动测试,基本上不存在一致性或认证。由于标准化机构和CharIN e.V.各小组的工作,统一的一致性和互操作性测试规范即将发布。在这一里程碑的基础上,本次会议介绍了实现互操作性的一般方法和实现方式——这是被市场广泛接受的基本标准。内容主要侧重于混合充电系统(CCS)大功率充电器和车辆的测试,但也适用于中国GB/T标准和日本CHAdeMO。

The market demand for electric vehicles (EVs) and its infrastructure (EVSE) grew rapidly – and with it, the customer’s expectations. Over the last two years, average battery capacity of new EV models and maximum DC charging power increased significantly, even beyond the electrical specification of relevant original charging standards, such as IEC 61851-23. As an EV or EVSE manufacturer, how do you keep up with decreasing time-to-market expectations while increasing product quality? Until now, charging interfaces of electric vehicles and supply equipment have been tested manually for the most part, conformance or certification basically did not exist. Due to the effort of experts in standardization bodies and CharIN e.V. focus groups, harmonized conformance and interoperability test specifications are about to be published. Based on this milestone, this session introduces the general approach and implementation of achieving interoperability – a fundamental criteria for broad market acceptance of E-Mobility. The content will mostly focus on testing of Combined Charging System (CCS) high power chargers and vehicles, but is also applicable for Chinese GB/T standard and Japanese CHAdeMO.

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茶歇和抽奖;Tea Break and Lucky Draw

Tuesday, Oct 13, 2020, 2:30 PM - 3:00 PM, Room EXPO Hall

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Technical Session

下一代高速高性能测试;Next generation for unseen speed in high performance test

Tuesday, Oct 13, 2020, 3:00 PM - 3:30 PM, 展厅会议室 Main Stage - Expo Hall

Speaker(s): Jian Wang,Product Manager

Markus Loerner,Market Segment Manager for RF & Microwave Component Test,Rohde & Schwarz

Track(s): Test and Measurement

随着5G逐渐成熟并走向主流,有必要确保设计结果被充分表征并可以投入生产。测试仪器对于提高设备性能和测试速度非常重要。本演讲将采用一种新颖的方法来帮助提高测试速度。这种方法不仅使射频信号数据采集与信号分析脱钩,而且不止于此。结果是在保持设备的RF性能的同时,大大减少了执行数百万次测试所需的时间。

As 5G matures and looks to going mainstream there is a need to ensure designs are fully characterized and become ready for production. The demands on test equipment are great to deliver both device performance and test speed. This presentation will be on a new novel approach to help optimize test speed. This approach not only decouples the RF signal data acquisition from the signal analysis, but goes far beyond it. The results are to dramatically cut the time needed to perform the millions of tests while maintaining a device’s RF performance.

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Keysight Education Forum

为分析物联网设备高效捕获波形;Efficient Capture of Waveforms for IoT Device Analysis

Tuesday, Oct 13, 2020, 4:30 PM - 5:00 PM, Room 401

Speaker(s): Richard Geng

当前的画像文件提供有关IoT设备行为的最透明的见解。但是,完整的表征需要分析数小时甚至数天的数据。在海量数据库中手动检测异常波形既困难又耗时。本课程将重点演示我们的新软件解决方案,该解决方案使您能够以高达10MSa/s的速度测量和记录当前数据。该软件可以快速高效地对数据进行分类,因此您可以在几秒钟内在TB(或更高)的数据日志文件中定位异常罕见的事件。

Current profiles provide the most transparent insights into the behavior of IoT devices. However, a complete characterization requires the analysis of hours or even days of data. Detecting anomalous waveforms manually within a massive database is challenging and time-consuming. This session will focus on the demonstration of our new software solution that allows you to measure and record current data at up to 10 MSa/s. The software can quickly and efficiently categorize the data so you can, in a matter of seconds, locate an exceptionally uncommon event in a terabyte (or higher) data log file.

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Workshop

带宽与无线通信系统;Bandwidth and Wireless Communication Systems

Tuesday, Oct 13, 2020, 3:00 PM - 3:30 PM, Room 403

Speaker(s): Mercy Chen,Analog Devices

带宽一直是无线通信系统设计的关键指标之一。从第一代无线通信系统开始到现在的几十年当中,信号带宽从最初的KHz量级发展到了现在的差不多1GHz的量级。不同的应用系统不仅带宽不同,而且要在系统的主要性能结构上做取舍。比如窄带的应用系统,一些系统要求有跳频功能,一些系统要求支持调频的调制方式;MIMO的系统要求收发多通道的集成并且保持低功耗;而微波5G的系统则要求链路具有超宽带的信号处理能力等等。利用世界领先的工艺技术,ADI可以为无线通信不同的应用场景提供不同的系统解决方案,从窄带应用,宽带应用一直到超宽带应用。

Bandwidth is one of the key specs in wireless communication systems. Started from the first generation wireless communication system, the signal bandwidth has been developed from KHz to around 1GHz in the past decades. Different systems require different bandwidth, they also need to make trade-off between key features. Narrow band application system, for example, some private networks requires frequency hopping function, some private networks need simple frequency modulation; MIMO system requires multi channels high integration with low power consumption; mmW 5G system requires ultra wide band signal processing capability etc. With leading technologies, ADI can provide different system solutions for different application scenarios, covering narrow band, wide band and ultrawide band application requirements.

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Workshop

如何根据应用评估和选择合适的电缆组件;How to evaluate and select the suitable cable assemblies based on the applications

Tuesday, Oct 13, 2020, 3:00 PM - 3:30 PM, Room 405

Speaker(s): Wei Liu,President,Mitron Inc.

选择合适的测试和连接电缆组件通常会使工程师头痛。他们的困难在于他们不知道根据相关应用应该关注什么性能,哪种指标对他们的应用最重要,同时又从市场上可以得到什么样的东西,以及如何在产品指标之间进行折中取舍。研讨会描述了测试,连接,温度循环测试,大功率,相控阵天线,地面,船载和机载等各种应用,并分析了各种应用对电缆组件的指标要求,介绍了评估和测试相关电缆指标的方法。

Select the suitable test and connecting cable assemblies usually makes the engineers headache. Their difficulty is they don’t know what performance that they should care about, which specification is most important according to their application, and meanwhile what kind thing that they can get from the market, and how they can make the trade-off among the various specifications. The workshop describe various applications such as test, connection, temperature cycles test, high power, phase array antenna, ground, shipborne and airborne etc. analyze the requirements on cable assemblies by the various applications, and introduce the method that evaluate and test the related specifications.

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ACB Training

中国市场的无线产品认证;Wireless Product Approval for China Market

Tuesday, Oct 13, 2020, 3:00 PM - 5:30 PM, Room 407

Speaker(s): Vivian Guan,Marketing Manager,Washington Laboratories Ltd

产品日益智能化的时代已经到来,大多数电子产品必须获得中国认证,如CCC、SRRC和NAL,才能投放市场,包括以电子商务方式。

在这次分享中,我将介绍中国CCC认证和SRRC认证的法规和要求。

The era of increasingly intelligent products is upon us,The most electronic products must get the China Approval when the product has been placed on the market, including e-commerce way. Such as CCC, SRRC and NAL.

In this sharing, I will introduce regulations and requirements of China CCC certification and SRRC certification.

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Technical Session

THz混频器和转换器的幅度和相位测量;Magnitude and phase measurements on mixers and converters in the THz range

Tuesday, Oct 13, 2020, 3:30 PM - 4:00 PM, 展厅会议室 Main Stage - Expo Hall

Speaker(s): Fei Xun,Product Manager,Rohde & Schwarz

Thilo Bednorz,Senior Applications Development Expert,Rohde & Schwarz

Track(s): Test and Measurement

110GHz及以上的毫米波组件和系统的军事和商业市场正在迅速增长。混频器和频率转换器是将基带信号向上转换到毫米波频带或从毫米波频带向下转换的关键组件。随着基带信号带宽增长到1GHz甚至更高,增益和群延迟的平坦频率响应对于数据传输的低误码率或相控天线阵列模块的高目标分辨率变得越来越重要。但是,在这个频率范围内表征混频器和转换器非常困难,过去几乎不可能测量相位和群时延。在本次会议中,展示了一种基于VNA的新系统,该系统提供了全面表征110 GHz及更高频率下具有高精度的混频器和频率转换器的方法。

The military and commercial market for components and systems in the mm-wave frequency range to 110 GHz and beyond is growing rapidly. Mixers and frequency-converters are the key-component to up- or down-convert a baseband signal to or from a mm-wave frequency band. With growing bandwidths of baseband signals to 1 GHz or even beyond, flat frequency response of gain and group delay becomes more and more critical for low bit error rates of data transmission or high target resolution for phased antenna array modules. However, the characterization of mixers and converters in this frequency range is very difficult, the measurement of phase and group delay was nearly impossible in the past. In this session a new VNA based system is shown, that offers methods to fully characterize mixers and frequency converters with high accuracy at 110 GHz and beyond.

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Workshop

具备深背部通孔的砷化镓集成无源器件的制作技术;Fabrication Technology of GaAs Integrated Passive Devices with Deep Backside Vias

Tuesday, Oct 13, 2020, 3:30 PM - 4:00 PM, Room 405

Speaker(s): Guangwei Huang,Engineer,UniCompound Semiconductor

本文介绍了一种具备深背部通孔特点的砷化镓无源器件制作的芯片滤波器,并对其射频特性进行了进一步的讨论。在背部通孔深度达到200um且形貌垂直的基础上,制备出一背部垂直电感,测试结果表明:在3.3-4.2GHz频带内,该芯片滤波器的插入损耗(IL)<1.6dB,带内回波损耗<-30dB,可以满足当前微波毫米波系统中的大规模应用。并且该芯片滤波器的设计尺寸为1.0mm x 1.0mm x 0.25 mm,与传统滤波器相比,面积缩减了近90%,符合当前通信系统器件小型化的发展趋势,具有广阔的应用前景。

In this paper, a signal filter made of GaAs passive devices with deep back through hole is introduced, and its radio frequency characteristics are also further discussed. A vertical inductor with High Q factor was fabricated ,while the depth of Backside Via is 200um and the morphology is vertical. The test results show that the insertion loss (IL) < 1.6dB and the in-band return loss <-30dB of the filter in the 3.3-4.2GHz band, meet the wave systems demand in the current microwave and millimeter. The design size of the chip filter is 1.0mm x 1.0mm x 0.25 mm, and the area of the traditional filter is reduced by nearly 90%. It accords with the development trend of miniaturization of communication system devices and has broad application prospects.

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Workshop

最先进的毫米波GaN/Si MMIC;State of the art mmW GaN/Si MMICs

Tuesday, Oct 13, 2020, 3:30 PM - 4:00 PM, Room 403

Speaker(s): Marc Rocchi,Chairman of OMMIC Science and Technology Committee

我们将研究按比例缩小的GaN/Si如何完全补充40nm以下CMOS,以满足毫米波5G基站、手机和回程链路的严格规格和成本预算。将介绍最新的T/R芯片。还将讨论手机毫米波功率放大器的热门话题,在低电源电压下将GaN/Si工艺缩小至20nm的能力。最后,将回顾GaN/Si与Si CMOS MMIC的异质集成,这表明RFIC技术的传奇即将到来。

We will review how scaled down GaN /Si fully complements sub 40nm CMOS to meet the stringent specifications and cost budget of mmW 5G base stations, handsets and backhaul links. New state of the art T/R chips results will be presented. The hot topic of mmW PA for handsets will also be discussed , with the capability of scaled GaN/Si processes down to 20nm at low supply voltages. Finally, the hetero-integration of GaN/Si with Si CMOS MMICs will be reviewed , showing the RFIC technology saga is reaching its final showdown.

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Keysight Education Forum

评估电-光-电连接系统的电气性能;Evaluate Electrical Performance in Electrical-Optical-Electrical Link Systems

Tuesday, Oct 13, 2020, 3:30 PM - 4:00 PM, Room 401

Speaker(s): Xindong Xue

数据中心使用光纤连接传输大量数据,以简化整个网络并提高容量。为了真正理解和评估电气系统的性能,请考虑整个链路状况,其中包括电光电(E-O-E)系统下的光通道。在本次会议中,我们将介绍使用PathWave先进设计系统(ADS)和VPI光子传输制造商的光学解决方案的业界第一种实时分析方法。该方法以所需的系统误码率预测设计裕度,例如眼图高度和眼图宽宽。

Data centers transport vast amounts of data using optical fiber connections to provide overall network simplification and greater capacity. To truly understand and evaluate the electrical system’s performance, consider the entire link condition, which includes the optical channel under electrical-optical-electrical (E-O-E) systems. In this session, we will introduce the industry’s first real-time analysis method using PathWave Advanced Design System (ADS) and VPI photonics Transmission Maker optical solution. This method predicts design margin, such as eye height and eye width, at the desired system bit error rate.

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Technical Session

5G信号分析仪中信道估计和跟踪算法分析;Analysis of channel estimation and tracking algorithm in 5G signal analyzer

Tuesday, Oct 13, 2020, 4:00 PM - 4:30 PM, 展厅会议室 Main Stage - Expo Hall

Speaker(s): Jia You,Senior Application Engineer,Rohde & Schwarz China Ltd.

Track(s): Test and Measurement

5G信号分析仪中信道估计和跟踪算法分析 本文介绍了5G和常见OFDM信号分析均衡和跟踪算法的基本原理,以及对矢量信号分析仪测试结果的影响。使用者能对测试中遇到的现象有一定的认识,并能在一定程度上指导设计和问题定位。

Basic principles of Channel Estimation and Tracking in OFDM signal analysis software are introduced in this paper, and the impact on the test results are also analyzed. These methods will help the user to identify the root cause of the errors and to optimize the design.

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Workshop

5G功率放大器设计变化对射频电路材料的需求;Choosing High Frequency Materials for 5G Power Amplifier Optimum Performance

Tuesday, Oct 13, 2020, 4:00 PM - 4:30 PM, Room 405

Speaker(s): Evan Yuan,Senior Technical Marketing Engineer,Rogers Corporation

5G作为下一代无线通信网络,已经从概念走向了商用和落地,在2020年将迎来大规模爆发。预计到2020年底将实现全国所有地级市5G网络覆盖,实现低成本高质量的5G网络覆盖变得非常重要。功率放大器作为5G基站的核心部件,在不同的应用场景,功率放大器的线性度、输出功率和效率等相应地会有不同的设计需求。本文将从功率放大器的电路板材料出发,讨论电路材料的关键特性对功放性能的影响,以及5G功放的设计变化带来的材料需求的变化等问题。

Next generation, 5G, wireless network technology has evolved from concept to commercial deployment. In China, by the end of 2020, it is expected 5G network coverage will be in all prefecture cities throughout the country. Therefore, low cost, high quality 5G base stations are very important. Power Amplifiers (PA) are the key component in 5G base stations and wireless communication systems. PA designs may be different in each network application. Design requirements may be different based on PA linearity, output power and efficiency. This paper will provide an overview of key PCB material properties to consider when designing a 5G PA and how these material properties influence 5G PA performance.

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Keysight Education Forum

如何找到FPGA电源轨的飘忽不定的动态开关电流;How to Find the Elusive Dynamic Switching Current of Your FPGA Power Rail

Tuesday, Oct 13, 2020, 4:00 PM - 4:30 PM, Room 401

Speaker(s): Xindong Xue

较低的工作电压和较高的电流使电源裕量成为产品开发中越来越重要的因素。对电源性能的完整评估必须包括向负载的电压和电流输出。在现场可编程门阵列(FPGA)负载下测量电压并不是太困难。但是,由于连接到多引脚FPGA负载的电流具有分布式特性,因此无法在负载处进行电流测量。了解PathWave ADS仿真与Infiniium示波器对功率传输网络(PDN)上动态电压的测量相结合,如何在FPGA上合成动态电流。

Lower operating voltages and higher currents are making power supply margining an increasingly critical part of product development. A complete assessment of the power supply performance must include the voltage and current delivery to the load. Measuring the voltage at a field-programmable gate array (FPGA) load is not too difficult. However, current measurement at the load is not possible because of the distributed nature of the current connecting to a multipin FPGA load. Learn how PathWave ADS simulation, combined with the Infiniium oscilloscope measurement of dynamic voltage across the power delivery network (PDN), can synthesize the dynamic current at the FPGA.

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Workshop

针对现代无线应用的欧洲GaN/Si工艺;European GaN/Si process for modern wireless application

Tuesday, Oct 13, 2020, 4:00 PM - 4:30 PM, Room 403

Speaker(s): Cédric Corrège,International Sales Manager,OMMIC

GaN技术是一种很有前途的技术,有时被视为III–V族化合物的第三次革命。OMMIC(位于巴黎附近的法国工厂)已经开发出独特的GaN/Si解决方案,专门用于毫米波射频MMIC制造。在对OMMIC的100 nm栅极长度技术(D01GH)及其优点进行了概述之后,将介绍最新的MMIC设计。这包括为电信以及国防应用设计的功率放大器、低噪声放大器和前端芯片。最后,将揭示OMMIC的GaN近期路线图。

GaN technology is a promising technology that is sometime qualified as the third revolution of III – V compounds. Among all GaN possibilities, OMMIC (a French foundry located near Paris) has developed a unique GaN/Si solution dedicated to mmW RF MMIC manufacturing. After an overview of OMMIC`s 100 nm gate length technology (D01GH) and its advantages, state-of-the-art MMIC designs will be presented. This includes PAs, LNAs and Front-end chips designed for Telecommunication as well as defense application. Finally, OMMIC`s short-term GaN roadmap will be revealed.

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Technical Session

5G OTA测量系统与核心技术;5G OTA Measurement Systems and Key Technologies

Tuesday, Oct 13, 2020, 4:30 PM - 5:00 PM, 展厅会议室 Main Stage - Expo Hall

Speaker(s): Lie Liu,Vice President and Adjunct Professor,General Test Systems

Track(s): Test and Measurement

本次报告将首先回顾3GPP规定的5G OTA测量的相关标准及方法,在此基础上介绍5G Sub6GHz MIMO OTA 测量系统及方法,及用于5G 毫米波段的紧缩场测量系统及反射面、馈源等核心技术。报告人为OTA测量系统的设计人员,将基于实际测量系统与结果展开讨论。

In this talk, I will introduce three 3GPP approved OTA test methods, namely, far field, indirect far field and near field method first. Two different types of chamber systems as well as test results will be discussed after that. Finally, conclusions will be given based on numerical simulation and chamber measurement.

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Workshop

为5G应用构建功率放大器设计框架;Building a Power Amplifier Design Framework for 5G Applications

Tuesday, Oct 13, 2020, 4:30 PM - 5:00 PM, Room 403

Speaker(s): Zhilong Wan,AWR Software Application Engineer

5G通信使用厘米波(cmWave)和毫米波(mmWave)频段给功率放大器设计和性能评估带来了新挑战。新标准中定义的较大瞬时带宽还需要更高级的数字预失真(DPD)算法,以实现所需的性能。射频/微波仿真软件提供了一个平台,可简化针对各种应用的功率放大器的设计和分析。本演讲重点介绍了如何使用AWR设计环境平台(现为Cadence Design Systems,Inc.的一部分)中的Visual System Simulator™(VSS)软件中的5G解决方案来测试功率放大器设计。VSS通信库包括LTE和5G信号生成以及针对具有可用载波聚合功能的上行链路和下行链路的分析功能。该软件还提供了测试平台,使用户能够投入其设计并执行符合标准的仿真,以及各种DPD解决方案,这些解决方案可用于测试功率放大器行为并预测能力校正问题。将提供许多可用的DPD解决方案,客户可以在流片前评估他们的设计。

Extension into centimeter-wave (cmWave) and millimeter-wave (mmWave) frequency bands in 5G communications has introduced new challenges in PA design and performance evaluation. The larger instantaneous bandwidths defined in the new standard also require more advanced digital predistortion (DPD) algorithms to achieve the desired performance. RF/microwave simulation software provides a platform that facilitates the design and analysis of PAs for various applications. This presentation highlights how 5G solutions in the Visual System Simulator™ (VSS) software within the AWR Design Environment platform (now part of Cadence Design Systems, Inc.) can be used to test PA designs. VSS communications libraries include LTE and 5G signal generation and analysis capabilities for both the uplink and downlink with available carrier aggregation. The software also provides test benches that enable users to drop in their designs and perform standards-compliant simulations, as well as various DPD solutions that can be used to test PA behavior and predict the ability correct issues once it becomes part of a complete system. A number of available DPD solutions will be offered that customers can use to evaluate their designs before tape-out.

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Workshop

功率放大器测试:从负载牵引到调制测试;Power Amplifier Test: from Load Pull to Modulated Test

Tuesday, Oct 13, 2020, 4:30 PM - 5:00 PM, Room 405

Speaker(s): Jianhui Wang,Senior Application Engineer,Rohde & Schwarz

Markus Loerner,Market Segment Manager for RF & Microwave Component Test,Rohde & Schwarz

能源效率、线性、输出功率和带宽是Tx RFFE的四个关键技术参数。后三个是受监管的,并且有最低要求,而效率指标体现了差异化优势,决定最终的成败。

设备越来越微型化以及将多个功能和通道集成到一个设备中,对RFFE及其在毫米波范围内的效率提出了新的挑战。最重要的是,由于RFFE会直接向天线馈电以进行波束成形,因此与现实环境的匹配成为热门话题。

该研讨会将讨论射频和毫米波范围内的RFFE表征。显然,5G是行业中的热门话题,因此我们专注于此目标应用。我们将讨论功率放大器设计和解决方案的各种效率提升功能,以便在缩减测试时间并同时提高灵敏度的同时获得对功能的最佳理解。我们的行业合作伙伴还将提供更多视角。

Energy Efficiency, Linearity, Output Power and Bandwidth are the four key technical parameters of a Tx RFFE. The latter three are regulated, and minimum requirements apply, whilst efficiency is the differentiator, the technical metric dictating ultimate success or failure.

Increasing miniaturization and integration of multiple functions and channels into one device pose a new challenge for RFFE’s and their efficiency in the mmWave range. On top, matching to real world environments is a hot topic, as the RFFE feeds the antennas for beamforming directly.

This workshop will address RFFE characterization in RF and mmWave range. Obviously, 5G is a hot topic in the industry so we focus on this target application. We will discuss various efficiency enhancements on the PA design and solutions to get best understanding on the capabilities while optimizing test time and improve sensitivity at the same time. Industry partners will round up the session offering an additional perspective.

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Keysight Education Forum

调制失真:PNA的残留误差矢量幅度;Modulation Distortion: Residual Error Vector Magnitude with PNA

Tuesday, Oct 13, 2020, 3:00 PM - 3:30 PM, Room 401

Speaker(s): Hong-Bo Mi

功率放大器(PA)在射频传输质量中起着至关重要的作用。PA设计人员需要在保持高效率的同时最大化线性度,还要在5G新无线电的毫米波(mmWave)频谱中实现较宽的信号带宽。要实现这种平衡具有很高难度。为了测量调制激励条件下功率放大器的非线性,业界使用误差矢量幅度(EVM)作为品带内特性的质因数(FOM),使用相邻信道功率比(ACPR)作为带外特性的质因数 。本次会议介绍了一种创新方法来表征被称为调制失真的宽带调制信号下设备的非线性失真。

Power amplifiers (PAs) play a critical role in RF transmission quality. PA designers need to maximize linearity while maintaining high efficiency. This balance is challenging to achieve with the wide signal bandwidths in the millimeter-wave (mmWave) spectrum for 5G New Radio. To measure the nonlinearity of a PA under a modulated stimulus condition, the industry uses error vector magnitude (EVM) as a figure of merit (FOM) for in-band characteristics and adjacent channel power ratio (ACPR) for out-of-band characteristics. This session introduces an innovative method to characterize the nonlinear distortion of a device under a wideband modulated signal called modulation distortion.

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Technical Session

克服为5G无线通信配置山顶频谱监测系统的困难;Overcome the challenges for setting up the hilltop spectrum monitoring system for the 5G wireless communications

Tuesday, Oct 13, 2020, 5:00 PM - 5:30 PM, 展厅会议室 Main Stage - Expo Hall

Speaker(s): Andrew Ko,Expert Application Consultant,Keysight Technologies Hong Kong Limited

Track(s): Test and Measurement

设计和建造山顶频谱监视系统始终会对检测、分类、识别和定位射频信号和干扰提出技术挑战,并且要求进行艰难的设置,使其能够在极端天气条件下长期运行,例如10 年。自2019年7月以来,此射频传感器系统项目已被接受用于频谱监测和干扰跟踪。本文将介绍基本要求,并介绍如何执行覆盖范围的仿真、克服极端天气条件(例如超过180km时速的风荷载)的设计、实际设置、具有成功结果的现场测试以及 未来的增强功能。

Designing and building hilltop spectrum monitoring system always presents technical challenges for detecting, classifying, identifying and locating RF signals and interferences as well as requiring tough set-up that can survive under the extreme weather conditions with a long period of operation, such as, 10 years. This RF sensor system project has been accepted since July 2019 for spectrum monitoring and interference tracking. This paper will introduce the overview of the basic requirements and describe how to perform the simulation for coverage, the design for overcoming extreme weather conditions such as wind loading over 180km/hour, the actual set-up, the field test with successful results and the future enhancements.

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Workshop

新功率测量技术满足当今苛刻的射频和放大器的需求;New Power Measurement Techniques for Today's Demanding RF World and Faster Power Serving for Amplifiers

Tuesday, Oct 13, 2020, 5:00 PM - 5:30 PM, Room 405

Speaker(s): Jian Wang,Product Manager

功率传感器是每个RF和微波实验室的常用工具,它们提供非常精确的功率水平测量。但是,实现这些精确功率测量的技术也有一些局限性。由于传统功率传感器的宽带特性,无法进行窄带功率测量或低电平功率测量。

在进行特性分析或最终生产测试之前,经常需要为诸如RF功率放大器之类的有源组件设置目标输出功率。由于该设备可能不是预先知道的或高度非线性的,因此使用了一个闭环控制系统,该系统由输出处的测量设备和输入处的源组成。nested system将有助于以几个数量级的幅度加快测量过程,可以代替传统的仪器远程控制。

本文将传统功率传感器与新型频率选择性功率传感器进行比较,以确保您可以针对正在测试的任何信号进行正确的功率测量。

Power Sensors are a common tool around every RF and Microwave lab, they provide very accurate power level measurements. However, the technology that enables these accurate power measurements, also has some limitations. Making narrowband power measurements or low level power measurements is not possible due to the broadband nature of a traditional power sensors.

Active components such as RF power amplifiers often require to be set to a target output power before running characterization or final production test. As the device may not be known upfront or is highly nonlinear, a closed loop control system consisting of a measuring device at the output and a source at the input is used. Instead of a classic remote control of the instrumentation, a nested system will help speeding up the serving process by order of magnitudes.

The paper will compare traditional power sensors, with new frequency selective power sensors to ensure that you can make the right power measurement for whatever signal you are testing.

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Workshop

用Virtuoso RF解决方案集成RFIC、RF模块设计以及签核流程;Integrated RFIC, RF Module Design, and Signoff Flow with Virtuoso RF Solution

Tuesday, Oct 13, 2020, 5:00 PM - 5:30 PM, Room 403

Speaker(s): Milton Lien,AWR Software Product Specialist

通常在无线电前端子系统中的集成无源设备(IPD)以硅、氧化铝或玻璃制造,以实现各种功能模块,例如阻抗匹配电路、滤波器、耦合器、巴伦和功率合路器/分路器。这些无晶体管电路包括离散的、分布的电感性和电容性元件,并与传输线结合在一起。需要电磁(EM)仿真来表征和优化这些单个结构以及整个无源设备本身的性能。特别是硅基板对EM仿真器提出了一些独特的挑战。RFIC芯片通常使用两种类型的EM仿真器:全3D和平面。本演讲将介绍使用Cadence EM仿真器、AXIEM 3D平面矩量法(MoM)和Analyst™3D有限元方法(FEM)作为AWR设计环境平台的一部分的示例,以解决硅的EM仿真问题。此外,演讲还将重点介绍如何将AXIEM EM仿真集成到Cadence Virtuoso RF平台中,以表征整个RFIC和IPD设计流程中的无源结构。

Integrated passive devices (IPDs), commonly found in radio front-end sub-systems, are fabricated in silicon, alumina, or glass technologies to realize functional blocks such as impedance-matching circuits, filters, couplers, baluns, and power combiners/dividers. These transistorless circuits comprise discrete, distributed inductive, and capacitive elements, combined with transmission lines. Electromagnetic (EM) simulation is required to characterize and optimize the behavior of these individual structures, as well as the entire passive device itself. Silicon substrates, in particular, present some unique challenges for EM simulators. There are two types of EM simulators commonly used for RFIC chips: full-3D and planar. This talk will present examples using the Cadence EM simulators, AXIEM 3D planar method-of-moments (MoM) and Analyst™ 3D finite-element method (FEM) as part of the AWR Design Environment platform, to address EM simulation issues for silicon. In addition, the presentation will highlight how AXIEM EM simulation is integrated into the Cadence Virtuoso RF platform to characterize passive structures within an overall RFIC and IPD design flow.

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欢迎晚宴;Welcome Reception

Tuesday, Oct 13, 2020, 6:00 PM - 8:00 PM, Room:四层北大堂(注册处前) 4th floor North Lobby

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Workshop

毫米波应用的技术趋势和基材解决方案;Technology trends and substrate solutions for millimeter wave applications

Wednesday, Oct 14, 2020, 2:00 PM - 2:30 PM, Room 406

Speaker(s): 赖罗鲁羲,生益科技

毫米波雷达/5G天线的应用越来越广泛,针对技术趋势进行探讨,给出成熟的基材解决方案。

Millimeter wave radar / 5G antenna is widely used. This speech discusses the technology trend and gives a mature solution to the substrate.

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ANSYS High Frequency & High Speed Simulation Forum

56G SerDes仿真最佳实践;Best Practices for 56G Serdes channel simulation

Wednesday, Oct 14, 2020, 9:00 AM - 9:30 AM, Room 406

Speaker(s): 黄健 Huang Jian,ZTE

通过使用HFSS 3D Layout软件对25G和56G两个仿真案例研究,展示了HFSS 3D Layout在精度、速度和易用性上的诸多优点,探索了三种建模方法,总结了高速serdes仿真最佳实践,同时对案例中的谐振成因和优化做了进一步研究和验证。

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Keysight Education Forum

信号分析基础-1;Signal Analysis Fundamentals-1

Wednesday, Oct 14, 2020, 9:00 AM - 9:30 AM, Room 401

Speaker(s): Chengzhi Sun

随着技术的快速发展和测试复杂性的增加,了解频谱分析的基础知识与以往一样至关重要。无线设计师关注如何满足当今的标准,同时又要保持足够的灵活性以应对未来的技术。了解频谱分析仪主要部分的工作方式将使您能够最大化被测系统的性能。

在本课程中,您将学习如何通过优化分辨率带宽、视频带宽和动态范围标准以实现最精确的测量来节省时间、避免错误并避免返工。我们还将讨论失真和噪声对测量精度的影响。

本次会议将:解决信号分析仪所需要的测量难题。描述当今的现代信号分析仪的体系结构。提供技巧以最大化信号分析仪的设置,以优化其性能,并从被测设备或系统中获得更多收益。谁应该参加:想要更充分地利用其频谱分析仪功能的工程师。

With technology rapidly evolving and test complexity increasing, understanding the fundamentals of spectrum analysis is as essential as ever. Wireless designers are concerned with meeting today’s standards while staying flexible enough to handle future technologies. Understanding how the main sections of a spectrum analyzer work will allow you to maximize the performance of your system under test. During this session, you will learn how to save time, prevent mistakes and avoid rework by optimizing resolution bandwidth, video bandwidth, and dynamic range criteria for the most accurate measurements. We’ll also discuss the impact of distortion and noise on the accuracy of measurements.

This session will:· Address measurement challenges that require a signal analyzer.· Describe the architecture of today’s modern signal analyzers.· Provide tips to maximize the settings of a signal analyzer to optimize its performance and get more out of your device or system under test. Who should attend: Engineers who want to more fully utilize the capabilities of their spectrum analyzers.

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Technical Session

在暗室内模拟电磁环境的方法;Methodology to emulate an electromagnetic environment in an anechoic chamber

Wednesday, Oct 14, 2020, 9:00 AM - 9:30 AM, Room 403

Speaker(s): Rui Guo,Senior Application Engineer,Rohde & Schwarz

Sam Chew,Technical Sales Manager,Rohde & Schwarz Asia

Track(s): EMC/EMI

电磁环境(EME)表示环境中存在的无线电信号的组合,这是由于无线电发射源的增加所致。随着技术朝着无线连接的方向发展,以及通过诸如雷达、运动和照相机之类的复杂传感器变得更加自治,这些产品对EME信号的敏感性还有待了解。常规电磁兼容性(EMC)标准未涵盖此类复杂信号,该标准仅限于诸如振幅调制和脉冲调制之类的调制技术。我们开发了一种在诸如暗室之类的受控环境中以高保真度记录和仿真这些信号的方法。

本文的目的是介绍在实验室中重现电磁环境条件的方法。本文还解决了一些关键难题,例如克服随时间变化的宽带信号的频率响应中的失真。

Electromagnetic environment (EME) represents the combination of radio signals which exist in the environment, owing to the increase in radio transmission sources. As technology moves toward wireless connectivity, and sometimes becoming more autonomous with sophisticated sensors such as radars, motion and cameras, there exists a gap to address the susceptibilities of these products against EME signals. Such complex signals are not covered under conventional Electromagnetic Compatibility (EMC) standards, which are limited to modulation techniques such as amplitude modulation and pulse modulation. A methodology to record and emulate these signals with high fidelity in a controlled environment, such as an anechoic chamber is developed.

The intention of this paper is to introduce approaches to reproduce environmental electromagnetic conditions back in the laboratory. Key challenges such as overcoming distortion in frequency response of varying broadband signals over time are also addressed in this paper.

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ACB Training

5G设备的FCC和RED要求;FCC and RED Requirement for 5G Device

Wednesday, Oct 14, 2020, 9:00 AM - 10:00 AM, Room 407

Speaker(s): Herve Idoko,Certification Engineer,ACB Inc.

在冠状病毒大流行中,世界在争夺高科技的霸权和5G技术的主导地位。就像其他无线电规范一样,大多数国家/地区都将其无线电产品合规性建立在FCC和CE上。从这个意义上讲,了解FCC和CE对5G产品合规性的要求是理解世界5G无线电合规性的非常重要的关键。在本演示中,我们将简短介绍5G技术以及FCC和CE合规性的法规要求。

In the middle of Coronavirus pandemic, the world is at war for high-tech supremacy and the dominance of the 5G technology. Just like in other radio requirements, most of the countries have based their radio products compliance on the FCC and CE mark.

In that sense, an understanding of FCC and CE requirements for compliance of 5G products is a very important key in understanding world 5G radio compliance. In this talk, we will be giving a short presentation of the 5G technology and also the regulation requirements for FCC and CE compliance.

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ANSYS High Frequency & High Speed Simulation Forum

Ansys高频高速仿真最佳实践专场;Ansys High Frequency and High Speed Simulation Best Practice Session

Wednesday, Oct 14, 2020, 9:00 AM - 12:00 PM, Room 406

随着5G、AI、自动驾驶等技术的不断普及,电子产品承担着越来越重要的功能和任务,但设计者也面对着更大的设计挑战,在电磁性能仿真方面,高速Serdes仿真,EMC仿真,天线雷达仿真都是业界关注的热点,在此专场中,业界及Ansys专家将分享Ansys产品在电磁仿真的最新进展,并分享各个热点方向的最佳实践案例,帮助设计者从容应对后续的电磁仿真挑战

With the continuous popularization of 5G, AI, autonomous driving and other technologies, electronic products are taking on more and more important functions and tasks, but designers are also facing greater design challenges. In terms of electromagnetic performance simulation, high-speed Serdes Simulation, EMC simulation, and antenna radar simulation are all hotspots in the industry. In this special session, industry and Ansys experts will share the latest developments of Ansys products in electromagnetic simulation, and share best practice cases in various hot directions to help designers calm down Respond to subsequent electromagnetic simulation challenges

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ANSYS High Frequency & High Speed Simulation Forum

Ansys Minerva的自动化DDR仿真管理实例;Cloud Based Automated DDR SI simulation management with Ansys Minerva

Wednesday, Oct 14, 2020, 9:30 AM - 10:00 AM, Room 406

Speaker(s): 章海文/ Zhang Haiwen,Aurora System

随着云计算、大数据、AI等领域的兴起,芯片的数据吞吐量也随之增长,DDR5应势而生。较低的电压、大量的仿真模型以及仿真难度随之而来的变大。为了解决这些难题,Ansys Minerva与Aurora Rocky相互集成研发出一套基于云的自动化DDR仿真平台。它颠覆了传统的仿真工具需要安装在本地的问题,只用浏览器便可操作。还将搭建DDR仿真流程的时间从天为单位量化缩减到以分钟为单位量化,同时还支持自动化的DDR仿真报告生成和数据管理,让仿真数据不再无处可寻。

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Technical Session

SSB相位噪声,概念和应用;SSB Phase Noise, Concepts, and Applications

Wednesday, Oct 14, 2020, 9:30 AM - 10:00 AM, Room 403

Speaker(s): Frank Thümmler,Rohde & Schwarz

Peng Chen,Product Manager

Track(s): RF & MW Design

单边带相位噪声是模拟信号发生器中信号质量的关键因素。近距离相位噪声、具有典型载波偏移为10 kHz或20 kHz的相位噪声与载波偏移通常为> 10 MHz的宽带相位噪声之间存在区别。为了获得卓越的性能,必须认真考虑这些领域中的每一个,以便满足应用中的高要求。您将了解参考振荡器、基于VCO或YIG的合成器以及PLL的环路带宽如何严重影响SSB相位噪声。

Single-Sideband phase noise is a key aspect of signal quality in an analog signal generator. A distinction is made between close-in phase noise, phase noise with the typical carrier offset of 10 kHz or 20 kHz, and the behavior far from the carrier, i.e. wideband phase noise with a carrier offset of typically > 10 MHz. To achieve outstanding values, each of these areas must be carefully considered in order to meet the high requirements in applications. You will learn how the reference oscillator, the VCO or YIG based synthesizer as well as the loop bandwidth of the PLL significantly influences the SSB phase noise.

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Keysight Education Forum

信号分析基础-2;Signal Analysis Fundamentals-2

Wednesday, Oct 14, 2020, 9:30 AM - 10:00 AM, Room 401

Speaker(s): Chengzhi Sun

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Technical Session

用于亚太赫兹大信号测量的功率控制和有源牵引的方法;A frequency scalable approach for power control and active tuning for sub-THz large-signal measurements

Wednesday, Oct 14, 2020, 9:30 AM - 10:00 AM, Room 402 A/B

Speaker(s): David Li,Maury Microwave Asia BD

Track(s): mmWave Technologies

从仪表本身的角度来看,亚太赫兹波段单片微波集成电路的表征面临着一些挑战。比如虽然我们可以使用矢网加扩频模块进行小信号S参数测量,但进行大信号测量却需要用到特定的仪表软硬件配置。

这里我们使用全新的方法扩展基于矢网接收机的小信号S参数设备配置,从而实现精确的功率控制,扫描以及有源负载牵引功能。这项技术在没有功率计探头的情况下基于特定的多步校准程序实现了对被测件端面功率的准确控制,这个程序预先对波导毫米波扩频模块的非线性功率响应进行表征,同时会对网分在该状态下的速度和动态范围大致定标。通过这步校准原本的系统可以在毫米波扩频模块频率范围内扩展实现准确功率控制下的S参数和功率扫描功能。在更高阶的层面,MMW studio解决方案可以对传统扩频模块毫米波矢网硬件配置进行简单修改从而实现有源负载牵引能力,这个改动包含定制化的矢量调制单元,简称为VMU,它被置于网分和扩频模块之间,相位和幅度调制功能。

Characterizing electronic devices and MMIC at sub-THz frequencies presents several challenges from the point of view of the instrumentation. While S-parameter measurements can be performed using VNAs with mm-wave extenders, large signal measurements require dedicated measurement setups. A novel approach allows to expand the capabilities of conventional VNA-based sub-THz S-parameter setups to achieve refined power control, power sweeps and active load-pull.

The base of the proposed method is a dedicated multi-step calibration procedure, that allows to pre-characterize the non-linear power response of waveguide-based mm-wave extenders, in order to accurately measure and control power at the DUT reference plane without using power sensors, thus exploiting the speed and dynamic range of the VNA. In this way, the VNA can be used for both power-controlled S-parameters and power sweep-based measurements at any frequency covered by mm-wave extenders.

On a more advanced level, it is possible to implement small hardware modifications to conventional extender-based mm-wave VNA setup to achieve active tuning, i.e., active load-pull capabilities. In this case, a vector modulation unit (VMU) is inserted between the VNA and the extender modules, to add refined phase and amplitude modulation capabilities to the setup. In this contribution we explain the principles at the base of the proposed multi-step calibration procedure, we discuss the hardware implementation and the choices needed to allow active tuning, we explore the details of the system performance in relation with the available hardware, and show some practical application for device and IC characterization.

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Technical Session

高引脚数芯片的先进去耦方案;Advanced decoupling scheme for high pin count silicon

Wednesday, Oct 14, 2020, 9:30 AM - 10:00 AM, Room 405

Speaker(s): Jeff Cain,Director of Development,AVX

Track(s): Power Integrity

将讨论一种新颖的PCB电源平面去耦方案。将对当今去耦技术进行快速回顾。然后将展示一种新的陶瓷电容器技术。最后,使用安装在PCB上的大型FPGA展示了这种方法的优势。

A novel decoupling scheme for power planes of PCBs will be discussed. A quick review of decoupling as it stands today will be overviewed. Then a new ceramic capacitor technology will be shown. Lastly, using a large FPGA mounted on a PCB, we will show the benefits of this methodology.

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咖啡时间和抽奖;Coffee Break and Lucky Draw

Wednesday, Oct 14, 2020, 10:00 AM - 10:45 AM, Room EXPO Hall

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ANSYS High Frequency & High Speed Simulation Forum

电子产品EMC仿真最佳实践;Best practices for Electronic devices EMC Simulation

Wednesday, Oct 14, 2020, 10:30 AM - 11:00 AM, Room 406

Speaker(s): Zhang Bailing,ANSYS China

本次演讲介绍了当今电子产品EMC仿真的重要性,重点介绍了如何使用ANSYS自带的虚拟测试环境来进行典型的传导干扰和辐射干扰的仿真案例。结合案例,讲解EMC仿真的策略、流程及具体的操作方法。

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Technical Session

UWB 802.15.4/4z技术和测试挑战;UWB 802.15.4/4z Technologies and Test Challenges

Wednesday, Oct 14, 2020, 10:45 AM - 11:15 AM, 展厅会议室 Main Stage - Expo Hall

Speaker(s): Xiang Feng,Product planner,Keysight Technologies

Track(s): Test and Measurement

UWB(超宽带)是IEEE 802.15.4中定义的PHY,广泛用于具有低数据速率无线连接和精确测距的各种应用,也用于车辆的安全访问控制。在本文中,我们将介绍一个超宽带系统,并介绍802.15.4/4z中的关键技术,例如调制方案、测距和安全性。将讨论AoA(到达角)和ToF(飞行时间)的高级功能的技术和测试挑战。将介绍用于解决这些挑战并满足研发和制造测试要求的测试平台和解决方案。

UWB (Ultra Wide Band) is the PHY defined in IEEE 802.15.4, which is widely used in a variety of applications with low date rate wireless connectivity and precision ranging, also for secure access control of vehicles. In this paper, we will give an over of UWB system and introduce the key technologies in 802.15.4/4z, such as modulation schemes, ranging and security. The technical and test challenges for the advanced features of AoA (Angle of Arrival) and ToF (Time of Flight) will be discussed. The test platforms and solutions to address these challenges and meet the test requirements for R&D and manufacturing will be introduced.

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Workshop

电子束光刻技术制作0.15/0.1μm高功率GaAs pHEMT;Electron Beam Projection Lithography Based 0.15/0.1μm High Power GaAs pHEMT Process

Wednesday, Oct 14, 2020, 10:45 AM - 11:15 AM, Room 405

Speaker(s): Zhiguang Chen,Engineer,UniCompound Semiconductor

经过福联集成电路公司工作人员的探索与不懈努力,我们利用电子束光刻技术(Electron Beam Projection Lithography)成功制作生产出0.15/0.1μm T型栅结构的GaAs pHEMT,通过Silvaco仿真模拟,该技术下0.15 T型栅结构GaAs pHEMT器件特性参数皆接近业界较高水准,接下来简要为大家介绍电子束光刻生产0.15/0.1μm T型栅结构GaAs pHEMT的工艺流程。首先了解一下Epi(外延)结构,福联的GaAs外延结构包括一层高铟浓度,未掺杂的薄InGaAs通道层,上下δ掺杂比为2.5:1的双δ掺杂层为通道提供载流子。AlGaAs隔断层位于通道层与Si掺杂层之间,上层隔断层顶部设有一层AlGaAs肖特基接触层。

The GaAs pHEMT with 0.15/0.1μm T-gate structure was successfully produced by using Electron Beam Lithography Technology with the unremitting efforts of the staff of UniCompound Integrated Circuit Company. Through Silvaco simulation, the characteristic parameters of 0.15 μm T-gate GaAs pHEMT device are close to the high level of the industry. Next, we will briefly introduce the process flow of producing 0.15/0.1 μm T-gate GaAs pHEMT with e Electron Beam Lithography Technology.

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Technical Session

纳入射频模块后,对用于四合一服务的FTTH-GPON系统的物理性能进行评估;Evaluation of the Physical Performance of an FTTH-GPON System for Quad Play Services After the Incorporation of an RF Module

Wednesday, Oct 14, 2020, 10:45 AM - 11:15 AM, Room 402 A/B

Speaker(s): Andres Felipe Escallon Portilla,M.Sc. in Telecommunications and B.Sc. in Electronics and Telecommunications Engineering,Universidad del Cauca,Colombia

Track(s): Simulation and Modeling

本演讲提出了一种基于正交频分复用(OFDM)系统的射频模块的设计和仿真,该系统具有正交幅度调制(16-QAM),数据传输速率为10 Gbps,频率为10 GHz,使用仿真工具OptSim。为此,设计了光纤到户千兆无源光网络(FTTH-GPON)三合一系统(2.5 Gbps的语音/数据服务和0.8 Gbps的具有16-QAM的数字CATV视频服务)为了集成光纤承载无线电(RoF)模块并提供四合一服务(再加上移动互联网)。随后,基于光学性能监控(OPM)参数,例如:光接收机功率、误差矢量幅度(EVM)、星座图、信号,在结合RoF模块之后,评估FTTH-GPON系统的下行链路的物理性能:信噪比(SNR)、误码率(BER)、质量因子(Q)和眼图。结果表明,FTTH-GPON用户除三合一服务外还可能拥有第四种服务(移动互联网),因为使用该服务的接入网在“最后一公里”范围内可以保证移动服务的质量。当前标准光纤的部署证明了该系统的可行性。

This talk proposes the design and simulation of a radio frequency module based on an Orthogonal Frequency Division Multiplexing (OFDM) system with Quadrature Amplitude Modulation (16-QAM) at a data transmission rate of 10 Gbps and a frequency of 10 GHz using the simulation tool OptSim. For that purpose, a Fiber To The Home (FTTH)-Gigabit Passive Optical Network (GPON) Triple Play system (voice/data service at 2,5 Gbps and digital CATV video service with 16-QAM at 0,8 Gbps) was designed in order to integrate a Radio over Fiber (RoF) module and offer Quad Play services (Triple Play plus mobile Internet). Subsequently, the physical performance of the downlink of the FTTH-GPON system was evaluated after the RoF module was incorporated, based on Optical Performance Monitoring (OPM) parameters such as: Optical Receiver Power, Error Vector Magnitude (EVM), Constellation Diagram, Signal to Noise Ratio (SNR), Bit Error Rate (BER), Quality (Q) Factor, and Eye Diagram. The results show that it may be possible for FTTH-GPON users to have, in addition to Triple Play services, a fourth one (mobile Internet) because the quality of the mobile service is guaranteed within the “last kilometer” for access networks using the current deployment of standard optical fiber, demonstrating the feasibility of the proposed system.

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ACB Training

5G设备的FCC和RED要求(2);FCC and RED Requirement for 5G Device (Part 2)

Wednesday, Oct 14, 2020, 10:45 AM - 11:45 AM, Room 407

Speaker(s): Herve Idoko,Certification Engineer,ACB Inc.

在冠状病毒大流行中,世界在争夺高科技的霸权和5G技术的主导地位。就像其他无线电规范一样,大多数国家/地区都将其无线电产品合规性建立在FCC和CE上。从这个意义上讲,了解FCC和CE对5G产品合规性的要求是理解世界5G无线电合规性的非常重要的关键。在本演示中,我们将简短介绍5G技术以及FCC和CE合规性的法规要求。

In the middle of Coronavirus pandemic, the world is at war for high-tech supremacy and the dominance of the 5G technology.

Just like in other radio requirements, most of the countries have based their radio products compliance on the FCC and CE mark.

In that sense, an understanding of FCC and CE requirements for compliance of 5G products is a very important key in understanding world 5G radio compliance.

In this presentation, we will be giving a short presentation of the 5G technology and also the regulation requirements for FCC and CE compliance.

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Keysight Education Forum

针对射频和微波宽带信号产生改进测量完整性;Improve Measurement Integrity for RF and Microwave Wideband Signal Generation

Wednesday, Oct 14, 2020, 10:45 AM - 11:45 AM, Room 401

Speaker(s): Hong-Bo Mi

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ANSYS High Frequency & High Speed Simulation Forum

Ansys在5G天线仿真方面的关键技术更新;The Next Generation of Phase Array Simulation with HFSS

Wednesday, Oct 14, 2020, 11:00 AM - 11:30 AM, Room 406

Speaker(s): XU ZHANG,Senior Application Engineer,ANSYS CHINA

5G天线设计对小型化和集成化的要求越来越高,更多的不同频段辐射单元集成到有限的体积内,形成了高中低频单元嵌套的阵面结构,使得单元间互耦和周围环境影响成为关键因素。另外,4G/5G长期共存形成的A+P天线架构也使得阵面的构成更为复杂。本次演讲介绍了基于HFSS的阵列天线从单元设计到天线布局的仿真流程,重点介绍了HFSS新一代基于3D组件的有限大阵列仿真方法,基于非匹配网格的关键技术,突破性解决了具有不相同单元的有限周期结构的问题,结合迭代域分解法实现了精确快速的求解。

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Technical Session

一种智能电视2.4G WiFi吞吐量的测试方法;Test method for 2.4G WiFi throughput of smart TV

Wednesday, Oct 14, 2020, 11:15 AM - 11:45 AM, 展厅会议室 Main Stage - Expo Hall

Speaker(s): Dongli Han,技术员,南京中电熊猫家电有限公司 Nanjing China Power Panda Appliance Co., Ltd.

Track(s): Test and Measurement

随着智能电视的发展,消费者对智能电视2.4G WiFi性能的要求越来越高,如何测试并优化出更高性能的无线网络变得很重要。在2.4G WiFi测试中,由于测试环境容易受到外界因素的干扰,测试准确的吞吐量难度变得较大,存在很多的随机性和不确定性因素,所以改进测试环境和方法对测试2.4G WiFi吞吐量的准确性和提高WiFi模块的软硬件性能具有重要意义。

Test Method for Smart TV 2.4G WiFi Throughput With the development of smart TVs, consumers have higher and higher requirements for 2.4G WiFi performance of smart TVs. How to test and optimize a higher-performance wireless network becomes very important. In the 2.4G WiFi test, because the test environment is susceptible to interference from external factors, it is difficult to test accurate throughput, and there are many random and uncertain factors. Therefore, improving the test environment and methods for testing 2.4G WiFi The accuracy of the throughput and the improvement of the software and hardware performance of the WiFi module are of great significance.

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Workshop

考虑射频输入功率的面声波滤波器的仿真;Simulation of SAW device considering RF input power

Wednesday, Oct 14, 2020, 11:15 AM - 11:45 AM, Room 405

Speaker(s): Osamu Kawachi,Xiamen San’an Integrated Circuit Co. Ltd. Workshop

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Technical Session

基于DDRx的SI/PI联合仿真;SI/PI Co-Simulation based on DDRx interface

Wednesday, Oct 14, 2020, 11:15 AM - 11:45 AM, Room 403

Speaker(s): li yuting,SI Engineer,ZTE Corporation

lu xian,SI Engineer,ZTE Corporation

meng liqiang,SI/PI Co-Simulation based on DDRx interface,ZTE Corporation

孙跃,SI Engineer,ZTE Corporation

Track(s): Signal Integrity

通过SI-PI 联合仿真能观察到在信号速率增加以后电源和信号完整性之间的相互影响关系

Through SI-PI joint simulation, the interaction between power and signal integrity can be observed after the signal rate increases

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Technical Session

现代通信系统中天线阵列与非线性射频前端耦合效应的建模与仿真;Modeling and Simulation of Coupled Effects Between Antenna Arrays and Nonlinear RF Front Ends in Modern Communication Systems

Wednesday, Oct 14, 2020, 11:15 AM - 11:45 AM, Room 402 A/B

Speaker(s): Hawk Yang

Zacharia Ouardirhi,Business Development Director,AMCAD Engineering

Track(s): Simulation and Modeling

为应对5G网络发展开发新一代有源电子扫描阵列(AESA)是一项基本技术挑战。MIMO和智能天线是构建更高容量和能效的收发器的绝佳机会。但是,传统的设计规则和工具无法有效地应对这些挑战,此外,要进一步提高容量,必须知道最近的趋势是在更高的频率向更大的带宽发展。通过对收发器的性能、功耗和成本的折衷,基于先进的宏建模技术的精确系统仿真看起来是有效解决EM/电路范例的一种有前途的方法。本演讲重点介绍了一些先进的宏建模技术,用于提取合适的射频和天线模块模型。同样,用于构建块的提取和鉴定的相关表征测试设置将解决这些行为模型的问题。将介绍在复杂系统建模中的应用,以实现天线阵列和发射机的有效协同设计,并预测接口处的有害负载调制效果。

The development of a new generation of Active Electronically Scanned Array (AESA) to address 5G network development is a fundamental technical challenge. MIMO and smart antennas represent a great opportunity to build efficient transceivers with better capacity and energy efficiency. However, traditional design rules and tools cannot address appropriately to these challenges effectively, knowing moreover that recent trends towards larger bandwidths at higher frequencies will be necessary for further capacity enhancement. It appears that accurate system simulations, based on advanced macro modeling techniques is a promising way to address effectively the EM/circuit paradigm by combining interesting trade-off between performances, consumption, and cost for such transceivers. This presentation highlights some advanced MacroModeling techniques both for extracting the appropriate RF and antenna blocks models. Also, associated characterizations test setup both for the extraction and the qualification of the building blocks will address the issue of these behavioral models. Application on the modeling of complex systems will be presented in order to achieve an efficient co-design of antenna array and transmitters and predict unwanted load modulation effects at the interface.

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ANSYS High Frequency & High Speed Simulation Forum

Ansys HFSS车载雷达仿真最佳实践;Best practices for Ansys HFSS Vehicle Radar Simulation

Wednesday, Oct 14, 2020, 11:30 AM - 12:00 PM, Room 406

Speaker(s): 曹根林 Cao Genlin

无人驾驶、自动驾驶在当下正迅速的发展,在最关键的雷达感知方面,微波雷达因其精度高、识别能力强、适应性好等,可为无人驾驶技术提供各种高级辅助功能,如并线辅助场景识别、动态道路场景识别等。本主题主要介绍HFSS软件在车载微波雷达方面的应用,详细讲解如何利用HFSS软件,方便快捷地建模与仿真毫米波阵列天线、天线与车体的布局效应、动态道路场景模拟中的感知成像、ROM降阶模型等内容。

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Technical Session

以Virtuoso为中心的高级系统设计解决方案(高速和射频设计);Virtuoso Centric Advanced System Design Solution (High-Speed and RF Design)

Wednesday, Oct 14, 2020, 1:00 PM - 1:30 PM, Room 402 A/B

Speaker(s): Liang Jiang,Customer Engagement Product Engineer,Cadence

Track(s): Simulation and Modeling

面对摩尔定律的终结,作为一种解决方案,SiP(封装系统)已占据了主导地位。主要驱动因素:SiP中的异质性、尺寸和BOM(物料清单)成本推动了有关设计和仿真工具的全新且广泛的方法论。因此,裸片、封装和PCB之间的协同设计和协同仿真变得越来越必要和重要。当工程师遇到SiP中不同裸片、键合线和互连之间的耦合时,会感到困惑和无助。工程师也不知道如何解决这些问题,也会认为当前的流程过于繁琐而无法有效处理,尽管他们已经找到了造成这些故障的原因。此外,不同的供应商、不同的技术、不同的设计团队将在今天更加紧密地合作,以完成一个完美的项目。如何在他们之间协调这些工作以及如何从中管理这些库将是一项具有挑战性的工作。它们之间乏味的沟通和互动将大大降低开发效率。

Facing the end of Moore's Law, as a proposal solution, SiP (System in Package) has emerged its dominant position. The main drivers : Heterogeneity, Size and BOM (Bill of materials) cost in SiP push a new and wide methodology about Design and simulation tools. And thus, the co-design and co-simulation between Die, Package and PCB are becoming more and more necessary and important. Engineers will be confused and feel helpless when they encounter the coupling between different dies, bondwires and interconnects in SiP and so on. Engineers also will have no idea for how to solve these issues or think the current flows are too tedious to handle efficiently, though they have already located the causing of them. Also, different vendors, different technologies, different design teams will cooperate more tightly to complete a perfect project today. How to coordinate these jobs among them and how to manage these libraries from them will be a challenging work. The tedious communication and interaction among them will decrease the development efficiency greatly. All of above expedite a brain alike EDA platform.

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Workshop

基于ADI ADRV902X的5G Small Cell RU的参考方案;A 5G Small Cell RU reference design based on ADI ADRV902X

Wednesday, Oct 14, 2020, 1:00 PM - 1:30 PM, Room 405

Speaker(s): Shi Tianren,China Product Engineering Manager,Richardson RFPD

Xie Yong,Analog Devices

中国5G网络正在迅猛建设之中,室内覆盖作为重要的组成部分,将承载90%的数据业务。5G Small Cell作为主要的室内覆盖设备之一,备受运营商的青睐,市场需求巨大。Richardson RFPD设计并研发一5G Small Cell RU的软硬件参考方案,客户可以复制或优化,加速自研产品的上市时间。该方案基于ADI的最新一代射频收发器ADRV902X, 支持4T4R, 天线口输出功率27dBm,2.6GHz和3.5GHz频段可选,允许客户灵活配置3GPP的Option 8 或7.2(O-RON)。

Driven by fast 5G network building in China, indoor 5G network coverage is getting most important role to serve 90% data throughout. 5G Small Cell will become the major solution as one of indoor coverage facilities and be hugely demanded by the operators. Richardson RFPD designed a near-product-level 5G Small Cell RU solution including proven HW and SW, which will enable the customers to duplicate for their own complete products and accelerate the time to market. The design is based on ADI new generation transceiver ADRV902X, which supports 4T4R, 27dBm @ antenna, 2.6GHz and 3.5GHz options, 3GPP option 8 or 7.2 (O-RAN) capable with customized optimization.

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Technical Session

射频功率放大器的效率提升;Efficiency enhancements for RF power amplifiers

Wednesday, Oct 14, 2020, 1:00 PM - 1:30 PM, Room 403

Speaker(s): Jia You,Senior Application Engineer,Rohde & Schwarz China Ltd.

Markus Loerner,Market Segment Manager for RF & Microwave Component Test,Rohde & Schwarz

Track(s): Amplifier Design

能源效率、线性、输出功率和带宽是Tx RFFE的四个关键技术参数。后三个是受监管的,并且有最低要求,而效率指标体现了差异化优势,决定最终的成败。

该研讨会将讨论射频和毫米波范围内的RFFE表征。显然,5G是行业中的热门话题,因此我们专注于此目标应用。我们将讨论功率放大器设计和解决方案的各种效率提升功能,以便在缩减测试时间并同时提高灵敏度的同时获得对功能的最佳理解。我们的行业合作伙伴还将提供更多视角。

Energy Efficiency, Linearity, Output Power and Bandwidth are the four key technical parameters of a Tx RFFE. The latter three are regulated, and minimum requirements apply, whilst efficiency is the differentiator, the technical metric dictating ultimate success or failure.

This session will address RFFE characterization in RF and mmWave range. Obviously, 5G is a hot topic in the industry so we focus on this target application. We will discuss various efficiency enhancements on the PA design and solutions to get best understanding on the capabilities while optimizing test time and improve sensitivity at the same time. Industry partners will round up the session offering an additional perspective.

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Technical Session

电源电流评估和电热协同设计;Current Flow Evaluation of Power Supply and Coordinated Design of Electric-Thermal

Wednesday, Oct 14, 2020, 1:00 PM - 1:30 PM, 展厅会议室 Main Stage - Expo Hall

Speaker(s): 娴 卢,ZTE Corporation

孟 利强,ZTE

Track(s): Power Integrity

随着芯片速率的提高,核心电压的降低和电流的增加,PCB PDN设计成为PCB设计的主要挑战之一。由于PDN设计具有自己的特点,因此一种电源设计方案通常无法复制到另一种情况下,在2019年4月的EDI演讲中我们介绍了一种满足芯片噪声规范的方法。今年,我们将介绍电流通流和电热协同设计。在PCB设计中,我们需要评估电流和DC压降,我们知道,不同的PCB材料,板厚度,层数,铜含量和其他因素非常重要,并且不同的叠层配置在不同的温度下会产生不同的温升 电流相同,因此必须进行电热分析。本文主要研究电流评估方法,然后介绍一种电热协同设计的流程和方法,最后将仿真结果和测试结果进行对比。

With the increase of chip rate, the decrease of core voltage and the rise of current, PCB PDN design is one of the main challenges of the PCB design. Because PDN design has its own characteristic, so one kind of power supply design scheme is generally cannot be copied to another case, EDI CON convention in April 2019 speech we introduced a method to meet the chip noise specification. This year, we will introduce current flow and electric-thermal simulation. In PCB design, we need to evaluation the current flow and DC drop, and we know, different PCB materials, board thickness, number of layers, copper content and other factors are very important, and different stack configurations will have different temperature rise under the same current, so thermal analysis is necessary. This paper mainly focuses on the method of current flow evaluation, then, we introduce a method of Electric-Thermal co-design.

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Keysight Education Forum

电磁干扰分析和故障查找;EMI Interference Analysis and Trouble Shooting

Wednesday, Oct 14, 2020, 4:30 PM - 5:00 PM, Room 401

Speaker(s): Hai-Chuan Yang

本课程涵盖EMI基础知识:干扰、测试和表征。了解最新的EMI法规遵从程序、法规标准和EMI预一致性测量基础知识,以助力您的产品快速推向市场。

This session covers EMI basics — interference, testing, and characterization. Learn about the latest EMI compliance process, regulatory standards, and EMI pre-compliance measurement fundamentals to get your product to market quickly.

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ACB Training

EMC合规测试最重要的事情;Most Important Thing for EMC Testing for Regulation

Wednesday, Oct 14, 2020, 1:00 PM - 2:30 PM, Room 407

Speaker(s): Steven Yang,Manage of China branch of Washington Laboratories Ltd.

在产品批准过程中,由于对认证法规的理解不正确以及应用测试项目的方法不正确,产品常常不能满足法规要求。通过这次演讲,我们将向您展示法规的正确要求。

In the process of product approve, products often fail to meet the requirements of the regulations due to the wrong understanding of the certification regulations and the wrong method of applying the items of the testing. Today, with this talk, we will show you the correct requirements of the regulations.

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Workshop

应用于无线通信的化合物器件服务;Compound technology service for wireless communication application

Wednesday, Oct 14, 2020, 1:30 PM - 2:00 PM, Room 405

Speaker(s): 林义书 Lin Yishu,Xiamen San'an Integrated Circuit Co., Ltd

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Technical Session

IR Drop中的设计细节,包括载流量和电热混合协同设计;Design Detail in IR Drop including Current carrying capacity and Electrothermal hybrid collaborative design

Wednesday, Oct 14, 2020, 1:30 PM - 2:00 PM, 展厅会议室 Main Stage - Expo Hall

Speaker(s): Jun Wu,SHENZHEN EDADOC TECHNOLOGY CO.,LTD

Track(s): Power Integrity

电流正在增加到100A以上。PCB的载流量对于产品工程师而言越来越重要。我们担心如何设计PCB走线和过孔。工程师需要通过选择层来做出决定,并根据PCB的空间和成本进行权衡。电热混合仿真对于确定温度升高有帮助。可以将电热混合仿真输出到流体热分析。

Current increasing to more than 100A. Current carrying capacity in PCB is more and more critical for product Engineer. We are concern about how to design PCB Traces and Vias. Engineers need make decision by choosing layers and trade off by PCB space and Cost. And Electrothermal hybrid simulation is useful to determine how much temperature raising. The Electrothermal hybrid simulation can be output to Fluid thermal analysis.

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Workshop

功率放大器测试:从负载牵引到调制测试;Power Amplifier Test: from Load Pull to Modulated Test

Wednesday, Oct 14, 2020, 1:30 PM - 2:00 PM, Room 406

Speaker(s): Jianhui Wang,Senior Application Engineer,Rohde & Schwarz

能源效率、线性、输出功率和带宽是Tx RFFE的四个关键技术参数。后三个是受监管的,并且有最低要求,而效率指标体现了差异化优势,决定最终的成败。

设备越来越微型化以及将多个功能和通道集成到一个设备中,对RFFE及其在毫米波范围内的效率提出了新的挑战。最重要的是,由于RFFE会直接向天线馈电以进行波束成形,因此与现实环境的匹配成为热门话题。

该研讨会将讨论射频和毫米波范围内的RFFE表征。显然,5G是行业中的热门话题,因此我们专注于此目标应用。我们将讨论功率放大器设计和解决方案的各种效率提升功能,以便在缩减测试时间并同时提高灵敏度的同时获得对功能的最佳理解。我们的行业合作伙伴还将提供更多视角。

Energy Efficiency, Linearity, Output Power and Bandwidth are the four key technical parameters of a Tx RFFE. The latter three are regulated, and minimum requirements apply, whilst efficiency is the differentiator, the technical metric dictating ultimate success or failure.

Increasing miniaturization and integration of multiple functions and channels into one device pose a new challenge for RFFE’s and their efficiency in the mmWave range. On top, matching to real world environments is a hot topic, as the RFFE feeds the antennas for beamforming directly.

This workshop will address RFFE characterization in RF and mmWave range. Obviously, 5G is a hot topic in the industry so we focus on this target application. We will discuss various efficiency enhancements on the PA design and solutions to get best understanding on the capabilities while optimizing test time and improve sensitivity at the same time. Industry partners will round up the session offering an additional perspective.

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Technical Session

智能手机设计中的射频前端精确仿真面临的挑战;Challenges for RF Front End Accurate Simulation in Smart Phone Design

Wednesday, Oct 14, 2020, 1:30 PM - 2:00 PM, Room 402 A/B

Speaker(s): 向阳 王,Huawei Device Simulation Lab

Track(s): Simulation and Modeling

近年来,随着通信技术的飞速发展,人们的日常生活越来越与智能终端息息相关。随着5G技术被越来越多的人接受,智能设备的功能越来越多样化,系统也越来越集成。因此,留给硬件工程师调试的空间将越来越狭窄。随着产品周期的缩短,硬件工程师将有更少的时间调试智能终端。另外,随着MIMO和高频带的引入,越来越多的频带要被调试,并且调试变得越来越困难。因此,射频前端仿真技术变得越来越重要。高精度的RF仿真技术可以减少硬件工程师的调试工作量,并减少由于技术缺陷而对整个系统进行修改的次数。快速仿真技术可以缩短某些产品的研发周期。因此,高精度、高效率的仿真技术可以解决射频前端所面临的问题,从而提高产品竞争力。然而,要实现高精度、高效率和快速仿真,RF工程师面临以下挑战:1、如何为具有不同带宽和调制模式的有源组件构建高精度模型。2、如何建立高精度的无源组件模型:双工器、开关、L和C、Fewxymid和DivFEM。3、如何考虑这些组件的公差。4、如何使用EDA软件建立高精度通道模型。5、如何快速评估整个链接仿真的公差。6、如何构建快速准确的仿真计算方法。简而言之,当仿真频率覆盖Sub6G频段时,仿真工作在许多领域面临着越来越多的挑战。

In recent years, with rapid development of communications technologies, people's daily life is increasingly closely related to intelligent terminals. As 5G technologies are accepted by more and more people, the functions of smart devices are becoming more and more diversified, and the systems are becoming more and more integrated. Therefore, the space left for hardware engineers to debug will become increasingly narrow. With the shortening of the product cycle, hardware engineers will have less time to debug smart terminals. In addition, with introduction of MIMO and a high communications frequency band, more and more frequency bands are debugged, and debugging becomes more and more difficult. Therefore, the RF front-end simulation technology becomes more and more important. The high-precision RF simulation technology can reduce the workload of hardware engineers in debugging and the number of times that the entire system is modified due to technical defects. The fast simulation technology can shorten the R&D period of some products. Therefore, the simulation technology with high precision and efficiency can solve the problems faced by the RF front-end, in this way, the product competitiveness is improved. However, to achieve high-precision and high efficiency and fast simulation, RF engineers face the following challenges: 1.how to construct high-precision models for active components with different bandwidths and modulation modes. 2. How to establish a high-precision passive component model: Diplexer, Duplexer, Switch, L and C, Fewxymid, and DivFEM. 3. How to consider the tolerance of these components. 4. How to use the EDA software to establish a high-precision channel model. 5. How to quickly evaluate the tolerance of the entire link simulation. 6. How to construct fast and accurate simulation calculation method. In a word, when the simulation frequency is covering Sub6G band, the simulation work is faced with more and more challenges in many fields .

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Technical Session

输入-输出波形控制的连续逆F类功率放大器的研究;Investigation of Input-Output Waveform Engineered Continuous Inverse Class F Power Amplifiers

Wednesday, Oct 14, 2020, 1:30 PM - 2:00 PM, Room 403

Speaker(s): Ouyang Sihua,SENIOR FIELD APPLICATION ENGINEER,Focus Microwaves

Vincent Mallette,Director of Sales and Business Development,Focus Microwaves Group

Zhou Yang,SENIOR FIELD APPLICATION ENGINEER,Focus Microwaves

Track(s): Amplifier Design

对非线性输入和输出有源器件特性对连续逆F类功率放大器(PA)的影响进行了深入分析。显示了在宽带操作中利用输入非线性来改善和维持PA性能的可能方法,并提出了一种灵活的源二次谐波设计空间,该空间可降低输入匹配网络(MN)的设计复杂性。输入非线性的这种利用还可以减轻由于实际的场效应晶体管(FET)在连续逆F类PA操作中的动态拐点行为而导致的性能下降。这些分析通过矢量负载牵引(VLP)测量进行了验证,并用于实现宽带PA设计。在恒定的3 dB增益压缩下,在0.8-1.4 GHz范围内可实现超过75%的高漏极效率和超过38 dBm的输出功率。

An in-depth analysis of the continuous inverse Class F power amplifier (PA) accounting for nonlinear input and output active device properties is presented. The analyses show possible ways of exploiting input nonlinearity to improve and maintain PA performance in a broadband operation and proposes a flexible source second harmonic design space which reduces the input matching network (MN) design complexities. Such exploitation of input nonlinearity can also alleviate performance degradation due to dynamic knee behavior of a practical field effect transistor (FET) in continuous inverse Class F PA operation. The analyses are validated with vector load pull (VLP) measurements and utilized to implement a broadband PA design. High drain efficiency over 75% and output power more than 38 dBm are achieved over 0.8-1.4 GHz at constant 3 dB gain compression.

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Keysight Education Forum

网络分析仪基础;Network Analyzer Fundamentals

Wednesday, Oct 14, 2020, 1:30 PM - 2:30 PM, Room 401

Speaker(s): Da-Lu Guo

随着设备的发展和变得越来越复杂,了解网络分析的基础知识与以往一样至关重要。射频设计师关注如何满足当今的标准,同时又要保持足够的灵活性以应对未来的技术。了解网络分析仪的主要部分如何工作将使您能够优化被测设备的测量。在本课程中,您将学习如何通过优化中频带宽和动态范围以获得最准确的测量结果来节省时间、避免错误并避免返工。我们还将讨论系统误差、随机误差和漂移误差对测量精度的影响。

As devices evolve and become more complex, understanding the fundamentals of network analysis is as essential as ever. RF designers are concerned with meeting today’s standards while staying flexible enough to handle future technologies. Understanding how the main sections of a network analyzer work will allow you to optimize the measurement of your device under test. During this session, you will learn how to save time, prevent mistakes, and avoid rework by optimizing intermediate frequency bandwidth and dynamic range for the most accurate measurements. We’ll also discuss the impact of systematic, random, and drift errors on the accuracy of measurements.

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Workshop

ADI新一代射频集成收发芯片ADRV902X介绍;Introduction of ADI new RF transceiver product ADRV902X

Wednesday, Oct 14, 2020, 2:00 PM - 2:30 PM, Room 405

Speaker(s): Leo Chen,Product Application Engineer,Analog Devices

Shi Tianren,China Product Engineering Manager,Richardson RFPD

ADRV902X (Madura) 是ADI公司宽带射频集成收发芯片RadioVerseTM系列的新一代产品。该产品包含四路独立的射频收发通道,并集成了多个频率综合单元,高效的内部校准算法保证了该芯片极佳的射频性能。同时,ADRV902X集成了多项数字信号处理功能,例如下行闭环功率控制(CLGC), 数字削峰(CFR)和宽带数字预失真(DPD)等,从而提供一套完整的通信系统射频解决方案。本次交流主要介绍ADRV902X的架构和功能,以及相应的参考设计。The ADRV902X (Madura) is a highly integrated RF agile transceivers in RadioVerseTM family. The device contains four independently controlled RF channels as well as integrated synthesizers. With the embedded digital signal processing functions such as internal close loop gain control (CLGC), crest factor reduction (CFR) and wideband digital pre-distortion (DPD), ADRV902X provides a complete transceiver solution for small cell and macro base station equipment used in TDD or FDD advanced communications systems. This session introduces the overview as well as a reference design of ADRV902X.

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Technical Session

SBW> 200 MHz时线性化功率放大器;Linearizing PA at SBW > 200 MHz

Wednesday, Oct 14, 2020, 2:00 PM - 2:30 PM, Room 403

Speaker(s): YASHASKAMAL SUVARNA,Portfolio Manager,NXP Semiconductor

Track(s): 5G/Advanced Communications

启用5G新无线电(NR)涉及重新分配现有频谱,以及分配低于6 GHz和毫米波频率的新频谱。对于大多数最初的低于6 GHz的5G部署,信号带宽(SBW)被限制为200 MHz,但是世界上许多地区分配的带宽要大得多。欧洲市场分配的频谱为3.4至3.8 GHz,印度市场为3.3至3.6 GHz,日本市场为3.6至4.1 GHz,韩国市场为3.3至3.8 GHz。利用整个频谱以高效的方式实现5G NR涉及设计进入RF有源天线系统的必要硬件,例如滤波器、前置驱动器、末级功率放大器、RF开关和LNA。功率放大器(PA)的一项关键设计要求是在不影响所需输出功率水平和目标工作频率下的线性度的前提下提高能效。在传统的RF前端配置中,PA针对特定频段进行了优化,从而形成了窄带匹配方案。仅宽RF匹配是必要的,但不足以确保宽SBW的线性化。高达SBW频率三倍的基带阻抗是限制线性化的最大因素。在本次演讲中,我们将讨论如何在200MHz以上的SBW上使用数字预失真(DPD)技术解决带宽问题并使PA线性化。

Enabling 5G New-Radio (NR) involves reallocation of existing spectrum along with allocation of new spectrum at sub 6 GHz and mm-wave frequencies. For most initial sub 6 GHz 5G deployments, the signal bandwidth (SBW) has been limited to 200 MHz, but many regions of the world have much greater bandwidth allocated. European market allocated frequency spectrum is 3.4 to 3.8 GHz, India market is 3.3 to 3.6 GHz, Japan market is 3.6 to 4.1 GHz, South Korea market is 3.3 to 3.8 GHz. Utilizing this entire spectrum to enable 5G NR in an efficient way involves designing necessary hardware that goes into the RF Active Antenna Systems such as filters, pre-drivers, final power amplifiers, RF switches and LNA. A key design requirement for power amplifiers (PA’s) is energy efficiency without compromising the linearity at the required output power levels and at the targeted operating frequency. In conventional RF front-end configuration, PA’s are optimized for a specific frequency band, which results in a narrow-band matching scheme. A wide RF match alone is necessary, but not sufficient to ensure linearization of wide SBW. The baseband impedance up to three times the frequency of the SBW is the biggest factor that will limit linearization. In this talk we will discuss how we can address the bandwidth issue and linearize the PA using digital pre-distortion (DPD) technique at SBW more than 200MHz.

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Technical Session

高速串行总线的布局细节仿真和测试;Layout detail simulation and testing for High-Speed serial bus

Wednesday, Oct 14, 2020, 2:00 PM - 2:30 PM, Room 402 A/B

Speaker(s): Jun Wu,SHENZHEN EDADOC TECHNOLOGY CO., LTD

Track(s): Simulation and Modeling

在高速串行总线设计中,布局细节对于性能越来越重要。许多不同的设计规则使电子工程师感到困惑。我们通过仿真和测试研究这些细节。包括建模和校准。有很多数据可以发现很多问题。这些细节包括:延迟调整、通孔设计和优化、串扰仿真等等。

In High Speed serial bus deign, Layout detail is more and more important for performance. Many different design rules make Electronics Engineer confuse. We study those detail by simulation and testing. Including modeling and calibration. There are many data can discovery many concerns. Those detail including: Delay tuning, Via design and optimizing, Crosstalk simulation. Etc.

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茶歇;Tea Break

Wednesday, Oct 14, 2020, 2:30 PM - 3:15 PM, Room EXPO Hall

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Workshop

基于ADI ADRV902X的5G Small Cell RU的参考方案;A 5G Small Cell RU reference design based on ADI ADRV902X

Wednesday, Oct 14, 2020, 3:30 PM - 4:00 PM, Room 403

Speaker(s): Shi Tianren,China Product Engineering Manager,Richardson RFPD

Xie Yong,Analog Devices

中国5G网络正在迅猛建设之中,室内覆盖作为重要的组成部分,将承载90%的数据业务。5G Small Cell作为主要的室内覆盖设备之一,备受运营商的青睐,市场需求巨大。Richardson RFPD设计并研发一5G Small Cell RU的软硬件参考方案,客户可以复制或优化,加速自研产品的上市时间。该方案基于ADI的最新一代射频收发器ADRV902X, 支持4T4R, 天线口输出功率27dBm,2.6GHz和3.5GHz频段可选,允许客户灵活配置3GPP的Option 8 或7.2(O-RON)。

Driven by fast 5G network building in China, indoor 5G network coverage is getting most important role to serve 90% data throughout. 5G Small Cell will become the major solution as one of indoor coverage facilities and be hugely demanded by the operators. Richardson RFPD designed a near-product-level 5G Small Cell RU solution including proven HW and SW, which will enable the customers to duplicate for their own complete products and accelerate the time to market. The design is based on ADI new generation transceiver ADRV902X, which supports 4T4R, 27dBm @ antenna, 2.6GHz and 3.5GHz options, 3GPP option 8 or 7.2 (O-RAN) capable with customized optimization.

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Technical Session

多芯片集成DDR颗粒的设计与仿真实践;Design and Simulation Practice of Multi-die Integrated DDR Particles

Wednesday, Oct 14, 2020, 3:30 PM - 4:00 PM, 展厅会议室 Main Stage - Expo Hall

Speaker(s): Jun Wu,SHENZHEN EDADOC TECHNOLOGY CO.,LTD

Track(s): Signal Integrity

在DDR存储器领域,目前我们通常使用单芯片封装的颗粒。从创新的角度来看,本演讲尝试通过引线键合工艺将多个裸片封装在一个颗粒中, 与单个裸片封装具有相同尺寸。通过高难度的设计和仿真方法来确保产品的顺利实现,并为 DDR DRAM的小型化和高密度设计提供了非常可行的解决方案。

In the field of memory DDR, we usually use single die packaged particles at present. From an innovative point of view, this topic attempts to package multiple dies in one particle through the wirebond process. Compare with the same size as the single DIE package, we can integrate the capacity of a large number of DIEs and ensure the smooth realization of the product through highly difficult design and simulation method, and provide a very feasible solution for the miniaturization and high density design of DDR dram.

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Technical Session

用于物联网的雷达技术;Radar Technology for IoT Applications

Wednesday, Oct 14, 2020, 3:30 PM - 4:00 PM, Room 402 A/B

Speaker(s): Henry Lau,CEO,Lexiwave Technology (Hong Kong) Limited

Sin Kei,Lexiwave Technology

Track(s): Radar and Antenna

传统上,雷达技术主要用于军事或遥感应用中。由于物联网、智能城市和智能家居应用的激增,对雷达技术的需求持续增长,因为它可以增强产品功能并增强竞争力。这些功能可能包括用于智能家居或智能城市应用的占位检测、手势检测、运动和速度检测以及物体检测。本次技术会议介绍了各种雷达技术,即用于消费类和物联网应用的脉冲、多普勒、FMCW和MIMO雷达。还将讨论使用不同雷达技术和工作频率的利弊。听众就可以据此将正确的雷达技术纳入其产品中并采用它们,以实现最佳性能。

Radar technology has been traditionally used mainly in Military or Remote Sensing applications. Due to the proliferation of IoT, Smart City and Smart home applications, the demand for radar technology continues to grow as it can enhance the product features as well as increase its competitiveness. The features may include occupancy detection, gesture detection, motion & speed detection and object detection for smart home or smart city applications. This technical session introduces different radar technologies i.e. Pulse, Doppler, FMCW and MIMO radar for consumer and IoT applications. Pros and cons of using different radar technologies and operating frequencies will also be discussed. The participants can then incorporate and adopt the right radar technology into their products for optimum performance.

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Workshop

频率高达50GHz的高效表面贴装封装;Cost Effective Surface-mount Packaging to 50 GHz

Wednesday, Oct 14, 2020, 3:30 PM - 4:00 PM, Room 405

Speaker(s): Yuon (Jonathan) Zhang,China Sales Manager,MiniCircuits

使毫米波器件能够发挥最佳性能同时又比chip-and-wire制造工艺具有更好的组装坚固性的封装技术已经有数十年了。通常,这些封装基于高温共烧陶瓷或类似的低损耗、稳定的材料,可最大程度地减少寄生效应。但是,在满足性能要求的同时,这些技术历来非常昂贵,需要手动组装过程,并且不具备表面贴装功能。另一方面,低成本、塑料包覆成型封装已占据了大批量、低频表面贴装应用的主导地位。该封装技术系列非常适合低于10GHz的情形,但是在20GHz或更高频率下要获得可接受的性能已被证明是困难的。随着Mini-Circuits继续将其产品线从10GHz以下推向Ku、Ka和更高频段,我们基于增强的多物理场建模方法、制造技术和材料开发了一种更加集成的产品设计方法,将leadframe-based封装推向高达50GHz的频率。

Packaging technologies that enable mmW devices to perform at their best while providing better assembly robustness over chip-and-wire manufacturing have been around for decades. Often these packages are based on High Temperature Co-Fired Ceramic or similar low loss, stable materials that minimize parasitic degradation. However, while delivering on the performance requirements, these technologies have historically been very expensive, require manual assembly processes and have not been surface-mount capable. On the other end of the spectrum, low-cost, plastic overmolded packaging has dominated the high-volume, lower frequency surface-mount applications. This family of packaging technologies is extremely well suited for sub 10 GHz operation, but achieving acceptable performance at 20 GHz, or higher, has proven difficult. As Mini-Circuits continues to push its product lines from sub 10 GHz into Ku, Ka and higher frequency bands, we have developed a more integrated product design methodology, based on an enhanced multi-physics modeling methodology, manufacturing techniques and materials to push leadframe-based packaging up to 50 GHz

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Keysight Education Forum

相位噪声应用与测量基础;Phase Noise Basics Applications & Measurements

Wednesday, Oct 14, 2020, 3:30 PM - 4:30 PM, Room 401

Speaker(s): Hai-Chuan Yang

本演讲内容涵盖了相位噪声测量的基础知识、为什么测量很重要以及相位噪声测量的技巧。参加会议以了解相位噪声如何影响接收器和系统设计的性能。

This session covers the fundamentals of phase noise measurements, why measuring is important, and tips to create phase noise measurements. Attend to learn how phase noise impacts the performance of your receiver and system designs.

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Workshop

高效GaN多尔蒂功率放大器设计;High Efficiency GaN Doherty Power Amplifier Design

Wednesday, Oct 14, 2020, 3:30 PM - 4:30 PM, Room 406

Speaker(s): Cadence AWR

本研讨会介绍了在输出功率回退时提供更高功率附加效率(PAE)的多尔蒂功率放大器的开发。通信放大器必须在更大的OBO电平下工作,以使设备保持在其线性区域,以减少具有PAPR功率比的信号的影响。将演示一个设计过程,包括主放大器和峰值放大器(AB类和C类GaN HEMT建模)中所用器件的特性,通过负载牵引分析确定最佳负载阻抗、阻抗匹配、阻抗逆变器设计、物理布局和通过EM分析进行的设计验证。

This workshop presents the development of a Doherty PA offering higher PAE at output power back-off. Communication amplifiers must operate at larger OBO levels to keep devices in their linear region to reduce the impact of signals with PAPR power ratios. A design process will be demonstrated that covers characterization of the devices used in the main and peaking amplifiers (modeling Class-AB and Class-C GaN HEMTs), identification of optimum load impedances through load-pull analysis, impedance matching, impedance inverter design, physical layout and design verification through EM analysis.

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ACB Training

EMC合规测试最重要的事情(2);Most Important Thing for EMC Testing for Regulation (Part 2)

Wednesday, Oct 14, 2020, 3:30 PM - 5:00 PM, Room 407

Speaker(s): Steven Yang,Manage of China branch of Washington Laboratories Ltd.

在产品批准过程中,由于对认证法规的理解不正确以及应用测试项目的方法不正确,产品常常不能满足法规要求。通过这次演讲,我们将向您展示法规的正确要求。

In the process of product approve, products often fail to meet the requirements of the regulations due to the wrong understanding of the certification regulations and the wrong method of applying the items of the testing. Today, with this talk, we will show you the correct requirements of the regulations.

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Workshop

ADI新一代射频集成收发芯片ADRV902X介绍;Introduction of ADI new RF transceiver product ADRV902X

Wednesday, Oct 14, 2020, 4:00 PM - 4:30 PM, Room 403

Speaker(s): Leo Chen,Product Application Engineer,Analog Devices

Shi Tianren,China Product Engineering Manager,Richardson RFPD

ADRV902X (Madura) 是ADI公司宽带射频集成收发芯片RadioVerseTM系列的新一代产品。该产品包含四路独立的射频收发通道,并集成了多个频率综合单元,高效的内部校准算法保证了该芯片极佳的射频性能。同时,ADRV902X集成了多项数字信号处理功能,例如下行闭环功率控制(CLGC), 数字削峰(CFR)和宽带数字预失真(DPD)等,从而提供一套完整的通信系统射频解决方案。本次交流主要介绍ADRV902X的架构和功能,以及相应的参考设计。The ADRV902X (Madura) is a highly integrated RF agile transceivers in RadioVerseTM family. The device contains four independently controlled RF channels as well as integrated synthesizers. With the embedded digital signal processing functions such as internal close loop gain control (CLGC), crest factor reduction (CFR) and wideband digital pre-distortion (DPD), ADRV902X provides a complete transceiver solution for small cell and macro base station equipment used in TDD or FDD advanced communications systems. This session introduces the overview as well as a reference design of ADRV902X.

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Workshop

P-1dB是什么? 确定放大器性能;What does P-1dB mean? Defining amplifier performance

Wednesday, Oct 14, 2020, 4:00 PM - 4:30 PM, Room 405

Speaker(s): Yuon (Jonathan) Zhang,China Sales Manager,MiniCircuits

在RF电路设计领域中,经常引用一些定义,这些定义广泛用于描述电路性能,有时是理所当然的。人们还可以发现,这些定义是本着产品差异化的精神“延伸”的。尽管营销人员有时会使用它们来区分产品性能,但这些关键定义的非标准化用法通常会导致误解,并最终使客户感到沮丧。对于射频放大器,一个完善的关键性能指标是其额定输出功率。放大器的输出功率有时简单地称为“输出功率”,没有基准或参考,因此几乎不可能知道放大器在从线性工作范围到非线性工作范围时的行为。通常,额定功率被指定为压缩1、2或3 dB(P-1 dB,P-2 dB或P-3 dB)时的输出功率、饱和输出功率(PSat)或这些术语的某种组合。通常被过于简化的是,这些功率性能指标的基础在很大程度上取决于测量条件和被放大信号的性质。更重要的是,这些术语是相对的度量,取决于其他一些属性。对这些定义及其用法有共同的理解应该有助于工程师与其服务的客户之间的沟通。

In the domain of RF circuit design there are definitions that are often cited, used extensively in describing circuit performance, and sometimes taken for granted. One can also find that these definitions have been “stretched” in the spirit of product differentiation. Whilst sometimes used by marketeers for product performance differentiation, the non-standardized usage of these key definitions most often leads to miscommunication, misinterpretation and ultimately frustration for customers. For RF amplifiers, a well-established and key performance metric is its rated output power. Amplifier output power is sometimes given simply as “output power” with no basis or reference, making it nearly impossible to know how the amplifier behaves in its transition from linear to non-linear range of operation. Commonly the rated power is specified as output power at 1, 2 or 3 dB compression (P-1 dB, P-2 dB, or P-3 dB), saturated output power (PSat), or some combination of these terms. What is often oversimplified is that the basis for these power performance metrics depends strongly on the measurement conditions and the nature of the signal being amplified. More importantly, these terms are relative measures, which depend on some other performance attribute. Having a common understanding of these definitions and their use should provide a common language between engineers, and the customers they serve

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Technical Session

PCB测量中几种去嵌入方法的比较;Comparison of several de-embedding methods in PCB measurement

Wednesday, Oct 14, 2020, 4:00 PM - 4:30 PM, 展厅会议室 Main Stage - Expo Hall

Speaker(s): Jianhui Wang,Senior Application Engineer,Rohde & Schwarz

Track(s): Signal Integrity

PCB传输线及表贴器件测量中,待测传输线或器件的S参数无法直接测量得到,需要做去嵌入计算。在最新一版的IEEE-370草案(第六版中),介绍了测试夹具设计准则和去嵌入效果的评估方法。本文通过商用电磁仿真软件得到PCB板上传输线及不同等级测试夹具的S参数;分别使用TRL法,Delta L法,ISD去嵌入软件及SFD去嵌入软件进行去嵌入计算,与仿真结果做了对比。最后讨论了各种方法的优缺点。

In the measurement of PCB transmission lines and surface-mounted devices, the S-parameters of the transmission line or device under test cannot be directly measured, and de-embedding calculations are required. In the latest edition of the IEEE-370 draft (in the sixth edition), the test fixture design criteria and the evaluation method of the de-embedding effect are introduced. This article uses commercial electromagnetic simulation software to obtain the S-parameters of the transmission line on the PCB and the test fixtures of different grades. The TRL method, the Delta L method, the ISD de-embedding software, and the SFD de-embedding software are used to perform the de-embedding calculations. Finally, the advantages and disadvantages of various methods are discussed.

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Technical Session

智慧城市的物联网和无线技术;IoT and Wireless Technologies for Smart Cities

Wednesday, Oct 14, 2020, 4:00 PM - 4:30 PM, Room 402 A/B

Speaker(s): Henry Lau,CEO,Lexiwave Technology (Hong Kong) Limited

Sin Kei,Lexiwave Technology

Track(s): Low Power RF and IoT

近年来,物联网(IoT)在商业和技术世界中变得越来越流行,并且物联网设备的数量在接下来的几年中将继续增长。随着无线技术的进步和新发展,更多的标准、组件和设备可用于物联网部署。全世界许多城市都在尝试使用IoT技术来提高生产力和效率,从而使自己变得更聪明。智慧城市可以为人们提供更好的生活、工作和娱乐。该技术会议介绍了适用于智慧城市物联网部署的各种无线技术。也介绍了使用不同技术和工作频率的利弊。将基于实际的系统实现示例来讨论实现挑战。还介绍了系统设计策略,以便听众可以采用正确的技术以实现最佳系统性能。

The Internet of Things (IoT) has become popular in business and technology worlds in recent years and the number of IoT device will continue to grow in the following years. With the advancements and new developments of wireless technology, more standards, components and devices are available for IoT deployments. Many cities around the world are trying to use the IoT technology to make themselves smarter with higher productivity and efficiency. The smart cities can provide a better place for people to live, work and enjoy. This technical session introduces various wireless technologies applicable for IoT deployment for Smart Cities. Pros and cons of using different technologies and operating frequencies will also be addressed. Implementation challenges will be discussed based on actual system implementation examples. System design strategies are also presented so that the participants can incorporate and adopt the right technology into their solutions for optimum system performance.

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Keysight Education Forum

低损耗介电材料测量;Low Loss Dielectric Materials Measurement

Wednesday, Oct 14, 2020, 1:00 PM - 1:30 PM, Room 401

Speaker(s): Jianming Yu

低损耗电介质材料常用作卫星、汽车、毫米波(mmWave)通信系统以及雷达/电子战阵列天线的基材或天线罩材料。研究人员一直在寻找能够满足微波和毫米波领域技术要求的新型先进材料。随着材料样品变薄,材料表征可能会变得困难。本次会议演示了两种技术,可以帮助研究人员准确、快速地评估这些频率下的低损耗材料。

Low-loss dielectric materials serve as substrates or radome materials for satellite links, automotive, millimeter-wave (mmWave) communication systems, and radar / electronic warfare array antennas. Researchers are constantly looking for novel advanced materials that can keep up with technology demands in the microwave and mmWave realms. As material samples get thinner, material characterization can be challenging. This session demonstrates two techniques that can help researchers accurately and swiftly evaluate low-loss materials at these frequencies.

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抽奖;Lucky Draws

Wednesday, Oct 14, 2020, 5:00 PM - 5:30 PM, 展厅会议室 Main Stage - Expo Hall

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