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ROG Blog

Rog博客由罗杰斯公司(Rogers Corporation)的John Coonrod及其他专家提供,包括有关RF/微波材料的技术咨询和信息。

浅析复合多层的DGS结构如何减小电路的辐射

2017-10-17
滤波器和天线设计工程师们很早就认识到,使用不同类型线路板材料加工制作而成的缺陷地结构(DGS)设计,可以改善分布式高频电路的性能。顾名思义,DGS是在微带线的接地平面上人为刻蚀出缺陷或中断结构,以实现分布式器件效应,如分布电感和分布电容。最常见的DGS形状就是在地平面上制作出简单的谐振U形槽,它可以增强传输线的耦合或减少谐波。这种设计常与微带电路一起使用,也可与带状线或接地共面波导(GCPW)电路等一起使用。
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浅析电路阻抗及影响其变化的PCB材料因素

2017-9-1
用于高速和高频应用的印刷电路通常依靠优良的传输线来进行信号传输。最常用的三种传输线技术分别是:微带线、带状线和接地共面波导传输线。在阻抗匹配的理想情况下,信号通过这些传输线的损耗是最小的,即传输线中阻抗连续、无中断和突变,同时具有某一最适合于通过电路信号传输的电抗值时。电路中阻抗的变化可能导致插入损耗增加、回波损耗增加、辐射能量增加、信号完整性降低以及上升时间降低。许多因素都可能影响PCB的阻抗,包括电路和电路材料的物理特性或电气特性,通过研究和更深入地理解这些变量,可以最大限度地减小其影响。
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浅析如何选择适合毫米波的传输线和线路板材料

2017-8-2
曾经一度,30 GHz以上的频率在民用领域是凤毛麟角,而仅仅用于军事或科学应用。但随着科技飞速发展,可用频谱资源日益紧张。现在毫米波频率已经开始应用于商用车载雷达,并在第五代(5G)无线通信网络中为毫米波应用做了大量规划,以用于支持高速传输的海量数据。越来越多的设计工程师正面临需要在77GHz及以上频率研发设计毫米波电路。但是,首先,工程师们必须为这些高频电路设计选择合适的传输线技术,同时还需要选择适合的线路板材料来保证这些电路的质量,降低传播信号的损耗。
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浅析表面处理对PCB最终性能的影响

2017-7-7
铜是高频PCB材料的优良导体,在射频和微波频率下它通常具有较低的损耗。但是如果PCB电路不做表面处理,其表面的铜就会发生氧化,会给焊接或连接带来隐患。多年来,PCB制造商已经研发出了可靠的工艺用于铜的表面处理,例如在铜箔表面电镀镍、金、锡或银等材料。虽然这些材料可以提供保护,使铜免受氧化的影响,但除了银,其它大多数材料的导电性能都比铜低。结果是:这种电镀镀层不但不能降低导体的导电性能,还会因为镀层增加电路的插入损耗。
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罗杰斯PCB材料为5G无线网络铺平道路

2017-6-12
第五代(5G)无线网络使用毫米波频率,拥有更宽的带宽,新的天线技术和调制技术,以及更高的载波频率,比4G LTE系统更高的信道容量和传输能力。虽然这些并没有完全确定,但是,在5G无线网络标准最终敲定之前,5G电路系统需要比目前4G LTE无线网络工作的2.6GHz更高的频率已经是板上钉钉的共识。
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浅析玻璃纤维对层压板性能的影响

2017-5-2
在印刷电路板(PCB)材料中添加玻璃纤维可以增加层压板的结构强度。这样有助于增加层压板材料的机械稳定性,但这是否会对材料的电气性能有影响呢?关于玻璃纤维增强PCB板的经典问题之一是“玻璃编织效应”可能会对加工在这些层压板上的高速或高频电路的电气性能产生负面影响。在本博客中,我们研究了影响玻璃编织效应现象的一些因素。
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浅析电路材料随温度变化的特性

2017-4-1
线路板材料的性能可以通过多种不同的参数进行评估,包括常见的介电常数(Dk)和耗散因数(Df)。这两个参数会随材料温度变化而发生变化,这种随温度变化的参数有助于人们了解线路板材料可能会发生的性能上的改变。特别是介电常数热稳定系数(TCDk)和损耗因子热稳定系数(TCDf),它们提供了详细依据来说明材料的Dk和Df随温度的变化量,这些指标变化越小表示材料(在温度上)性能更稳定。
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浅析适合于毫米波应用的线路板材料

2017-3-2
近年来,毫米波频率的应用越来越广泛,例如毫米波汽车雷达,以及即将到来的5G无线网络。诸如60GHz或77GHz毫米波频率的电路设计都必须采用低损耗电路,因此加工这样的电路肯定需要选择合适的线路板材料。在如此高的频率下选择线路板材料,必须要知道哪些电路和材料参数对电路性能具有最大影响,从而找到有利于这些毫米波频率特性的材料。
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浅析RF层压板材料组成结构及发展趋势

2017-2-3
我们知道技能方法会随着时间变得日益精湛,PCB射频微波电路板材料也是如此。通过不断的对原材料精心调配,从而实现层压板最佳的电气和机械性能。多年以来,很多不同的配方组合被开发用于制作高频线路板材料。通过这些努力,各种电路板材料应运而生,以适应应用范围更广的高频应用和更高的性能要求。
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浅析用于毫米波电路的传输线技术

2017-1-3
随着第五代(5G)无线网络技术的兴起和汽车雷达系统的广泛应用,毫米波频段被越来越多地使用。对于许多电路设计工程师来说,这些频率可能代表未知的领域,他们可能不仅需要考虑合适的印刷线路板(PCB)材料,还需要考虑最佳传输线技术,以及电路板布局和连接器信号转换等的一些因素。随着毫米波电路应用场景越来越多,许多电路设计工程师都面临着新的挑战。
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罗杰斯技术支持服务团队让您的产品设计和加工变得完美简单

2016-12-1
技术支持服务团队是罗杰斯公司整个技术服务架构的重要成员,他们随时可通过亲自拜访、邮件和电话等交流方式,为客户提供各类关于罗杰斯电路板材料的帮助。
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浅析如何选择适合卫星通信系统的线路板材料

2016-11-1
卫星通信系统需要电路材料在恶劣环境和在轨运行的情况下,仍然能保持优良的性能和较高的可靠性。很少有线路板材料能满足卫星系统如此苛刻且具有挑战性的要求。只有那些具备特殊特性的材料才能胜任。
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浅析如何选择适合滤波器的线路板材料

2016-9-29
为了获得最佳性能,滤波器设计工程师应该使用最佳特性的印制电路板(PCB)材料来设计射频/微波滤波器。电路板材料的选择不仅影响滤波器的性能,甚至还会影响滤波器电路的尺寸。
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浅析高温对线路板材料的影响

2016-9-1
高温能造成损害。印刷电路板(PCB)在材料研制时就需要考虑能承受一定的高温,但是当温度升高超过某一阈值,电路板性能,尤其是高频性能就会受到影响。如果一个电路设计工程师熟悉温度上升情况下描述线路板材料特性的各种参数,那么选择耐热PCB材料配合优化过的电路设计就可以承受一定的高温。
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浅析“热塑性”和“热固性”线路板材料的差异

2016-8-1
高温处理通常是高频线路板加工制造的重要环节。从开始形成的电介质半固化片到覆铜层压板,以及最终加工成型的电路元件,印刷电路板(PCB)材料的制作过程都需要加热。
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柔性电路的弯折/弯曲特性探讨

2016-7-6
柔性可弯折是PCB(印刷电路板)的一个重要特性。实际应用中不是所有电路板都是平面类型的,有些电路板为了满足特殊产品应用而需要一次弯折成形,而有些电路板则需要承受连续的弯折。
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多层板电路的热量控制

2016-6-1
多层电路是小面积内实现高密度电路的一种手段。伴随着这种紧凑型电路的一个挑战是如何实现功率晶体管等有源器件的散热问题。
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PCB层压板的Dk究竟如何确定?

2016-5-3
Dk(介电常数)是最重要的电路材料参数之一,也是电路设计者的一个设计出发点。包括不同类型传输线的高频电路结构尺寸以及实现隔离或耦合的导线间距等都是由电路材料介电特性确定的,其中一个最主要的介电特性参数就是Dk。
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越薄的电路材料更利于实现毫米波电路性能

2016-4-1
当电路的工作频率很高甚至到毫米波波段时,相比于较厚层压板材料,越薄PCB(印刷电路板)层压板可以为电气性能提供更多好处且同时改善机械性能
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电路中的过孔

2016-3-1
对于许多电路设计者,会使用电镀过孔(PTHs)连接电路平面之间的走线或路径。PTHs,也称为过孔,它为从一个导体平面到地平面、从一个信号平面和另一个信号平面、或从高电流或功率平面到信号平面等提供了连接路径。
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使用介质集成波导技术传输毫米波

2016-2-1
毫米波电路一贯被认为是非常独特且仅用于军事空间等特殊应用的技术。主要原因是毫米波频率范围从30到300GHz,该频段对应的波长短,要求专用元件和电路来适应短波长范围。
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表面处理工艺对宽带PCB损耗的影响

2016-1-1
表面处理对PCB电路加工是非常必要的。它不仅能够为元件焊接提供光滑可焊的表面,同时也为PCB的铜导体提供了保护。
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微带线和接地共面波导电路的比较

2015-12-8
电路设计者往往需要选用某种电路技术,如微带线或共面波导(GCPW)等,以及某种电路设计和某种电路材料来实现最优的性能。正如本系列博客的介绍,可以从电气特性和热特性等参数对电路材料进行比较,如介电常数、损耗、功率容量及高频带宽等。电路传输技术如微带线和接地共面波导电路都各有其优缺点,通过对两者的仔细比较有助于发现他们各自的特点。
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PCB 加工对微波性能的影响

2015-11-13
电路的性能从一开始就受到所用PCB材料的影响,但想要达到需求的电路性能与电路在PCB上的加工也密切相关。在近期的IEEE2015国际微波学术报告会中,罗杰斯公司作为参会代表,其在微波应用会议中的“PCB加工对微波性能影响”的汇报分析了诸多因素对PCB上加工的有源和无源电路性能的影响,如电路板厚度和传输线金属选择等。
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功率电路的微波PCB材料

2015-10-30
射频/微波功率放大器的设计可以选取分立晶体管或单片微波集成电路(MMICs)等有源器件实现。但在进行放大器电路设计时,不能忽视PCB材料的重要性。电路材料对功率放大器的设计影响可好可坏。为提高功率放大器性能,首先要了解对于功放设计哪些PCB材料的参数是非常重要的。
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微带线和接地共面波导的比较

2015-9-1
在为某一电路设计选择最优PCB材料时,高频电路设计者通常需考虑电路的性能变化、物理尺寸和功率高低。不同传输线技术的选择会影响电路设计的最终性能,如使用微带线或是接地共面波导(GCPW)。
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选用合适材料以减小相位噪声

2015-7-1
长期以来,相位噪声是振荡器、频率合成器以及雷达和通信接收器等高频系统的一个重要参数。许多著作或论文中提到的抑制相位噪声方法都通过减小不同类型振荡器或频率合成器的相位噪声来实现。 然而在实现低相位噪声性能过程中,PCB材料的作用常被忽视。
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在PCB上实现电容和电感

2015-6-1
电路设计工程师长期依赖PCB的基本物理特性以在PCB上通过简单的形式和结构实现电容和电感。例如,在PCB上,由于金属信号层平面和接地层平面是平行的,其间填充介质材料,这会导致PCB上形成寄生电容。
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高速数字电路的PCB材料选型

2015-5-1
随着微处理器和信号转换器等元件每秒数十亿次的运行速度,数字电路也不断达到更高的运行速度。诚然,传输线阻抗不连续性和多层电路板层间互连电镀通孔(PTH)的缺陷等都会对高速数字电路产生不良影响。
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共面波导的优化设计

2015-4-7
从射频到毫米波频段,高频电路设计者会设计大量不同的电路以获得不同需要的解决方案。共面波导(CPW)电路是普遍应用的微带线技术中一种解决方案。传统的共面波导是在介质基片的某个面上制作出导体线,并在紧邻导体线的两侧制作接地平面。
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基于稳定介电常数的延时线设计考虑

2015-3-2
在PCB电路中,延时线是模拟电路和数字电路中用于调节信号的非常有用的结构元件。高频高速延时线的主要特征包括工作带宽、延迟时间、工作带宽内的插入损耗、回波损耗、驻波比,上升时间以及延迟稳定性。延时线可以通过不同的电路元件来实现,比如同轴线、体声波元件、声表面波元件等,但PCB材料的选择会对延时线的最终性能产生重大影响。
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微波应用中的PCB寄生模抑制

2015-2-3
一般而言,不管如何优化设计, PCB中都会存在一定程度的寄生模。寄生模除了支持预期信号外,对噪声信号的支持将对预期信号产生干扰和衰减。这对PCB及其应用都造成了极大破坏。减轻寄生模的主要方法是系列的优化设计。实际上, 随着工作频率的升高,尤其是毫米波波段时,PCB材料的选型将对寄生模抑制产生显著影响。了解寄生模的产生将有助于合理抑制寄生模。
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高频信号在PCB上的有效传输

2015-1-5
在射频/微波系统中高频信号会经过多种媒介的传输,最具挑战性之一就是信号从同轴连接器传输到PCB板。若想在信号没有任何反射的情况下成功完成转换,连接器与PCB不仅要做合适的机械对齐,而且更需要细致的电气优化。信号可以在许多不同种类的同轴连接器和不同类型的PCB板材中传播,连接处的适当处理可以形成无缝的转换。以下的一些常用准则,有助于提高射频/微波信号在双层和多层PCB板上的传输的效果,特别是PCB板包含不同类型的传输线形式,如微带、带状线,和共面波导传输线。
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带状线为您的设计带来更多选择 -- 探讨多层板带状线电路

2014-12-1
高频电路设计师在选择传输线时会考虑带状线,尤其是在设计对微弱电磁辐射敏感的电路时。带状线可看作置于两个地平面间的扁导体,导体和地平面间用电介质材料隔离开。这种结构相对于微带传输线电路有较少的电磁辐射,相对于微带在相邻电路传输线间有较好的隔离度,但是这种掩埋式结构相对于微带线更难制作和维修 。
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功分器和耦合器的电路材料选择

2014-11-3
功分器和合路器是最常用\最常见的高频器件,对于耦合器例如定向耦合器来说也是如此。这些器件用于功分、合路、耦合来自天线或系统内部的高频能量,且损耗和泄露很小。PCB板材的选择对于这些器件实现所预想的性能来讲是一个关键因素。
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如何制作依赖耦合机理工作的微带电路

2014-10-1
微带传输线被广泛应用于高频的有源和无源电路中,对很多器件来讲他们都是组成的一部分,包括耦合器,滤波器,谐振器以及功分器和功率合成器,这些器件的耦合特性都是通过微带线从一个点将能量传输到另一个点得到的。
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微波电路的不连续性改良

2014-9-1
在设计高频微波电路时随着频率的升高,或者毫米波频率时,大部分布局要用精细设计的传输线来传输印刷电路板(PCB)的高频信号。当然,如果PCB的加工目标只是通过增加电路元件来为PCB创建必要的频域/时域响应,如电阻器、电容器、电感器,这个制作过程可能多少会变得容易一些。
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有关微波领域印制电路板的热量传递模式的探讨

2014-8-1
当射频/微波功率加载于印制电路板(PCB)上时会产生热量。在给定的PCB材料上设计一种实际的电路关键在于理解不同的材料特性如何影响射频/微波PCB的热性能,然后使电路在高频电路材料的温度允许范围内工作。
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低噪声放大器的电路材料选型

2014-7-1
低噪声放大器(LNAs)对于很多高频接收机是必不可少的,它可在保持噪声为最小值的同时提供所需的增益。设计有效的LNA电路通常可归结为对有源器件[]的关键选择,如晶体管或集总电路(IC)。
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用于确定PCB材料特性的环形谐振器方法

2014-5-30
电路设计经常需要特定的印制电路板材,而这些特定板材的选取一般是基于材料本身的性质,比如介电常数(Dk)和衰减系数(Df)。在低频段,已知板材精确的参数对于电路的设计或许有用但并不重要,然而在高频段,知道电路板材的参数如Dk和Df对于电路设计成功与否至关重要。
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深入研究PCB,努力实现低PIM

2014-5-22
无源互调(PIM)是无源电路或元件内不希望出现的2个或多个信号的混合产物,它会产生多余的杂散或谐波信号。这些多余信号会造成系统工作通带拥塞,并且干扰系统接收频带。
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测量铜箔表面粗糙度

2014-5-21
印刷电路板(PCBs)导体的表面粗糙度是一个不能忽视的材料参数。就像在前一篇系列博文中具体介绍的那样,PCB导体层的表面粗糙度对于通过导体的信号损失会有很大的影响。如果在设计阶段导体表面粗糙度的影响没有被考虑在内,那么在使用软件进行模拟时,结果可能会有偏差。
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力争实现完美引线键合

2014-4-1
引线键合让印刷电路板(PCB)上的一切都处于适当的位置,用于将无源和有源元件以及集成式电路(IC)通过金属引线与电路基板互连,甚至将一个电路基板连接到另一个上。引线键合可以通过多种不同的引线键合机形成,包括手动和自动模式。
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估计PCB层压板的表面粗糙度

2014-2-7
在设计射频/微波电路的时候需要一些印刷电路板(PCB)质量的知识,尤其是在为某一特定应用选择PCB 材料的时候。现代的CAE仿真工具可以用材料参数比如相对介电常数来进行计算从而预测在不同PCB材料上电路的电性能。
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为无铅工艺选择合适的PCB

2014-1-1
欧盟为无铅印刷线路板材料颁布的危害物质禁用指令(RoHS)是非常有意义的,但是也相应的影响到电路板的设计和制作。例如,含铅焊锡比无铅焊锡熔点更低。无铅焊锡的典型峰值焊接温度为260摄氏度。
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建立在可靠性上的平面电阻

2013-12-3
平面电阻可以和电路图型一起在所选择的高频板上加工形成。通过和在印刷电路板上形成电路同样的工艺步骤,可以将平面电阻植入到高频PCB中。他们可以拥有精确的数值,严格的公差,以及合理的功率容量。
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学习如何使用设计Dk

2013-11-3
介电常数(Dk)是印刷电路板材最重要的参数之一。电路设计者依靠它来确定微带电路的阻抗以及物理尺寸。但是在层压板的data sheet上我们经常可以看到同种材料有不同的Dk值,比如一个过程Dk以及一个规格Dk。
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用微带电路进行介电常数的测试

2013-10-1
电路设计者通过相对介电常数等参数来选择印刷电路板(PCB)的基材。层压板供应商在他们的参数表中以及网站上都提供了Dk值,但是由于Dk值和客户特定的应用密切相关,因此他们希望能够通过测试Dk值进行再次确认。
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测试线路板原材料的介电常数

2013-9-4
射频/微波设计者有很多线路板材可以选择,这既有好处也有坏处。因为有太多选择可能使挑选的过程变得困难,所以很多设计者首先考虑相对介电常数(Dk),把它作为一个关键的筛选参数。
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微波基材性能的测试效果

2013-8-1
每一份层压板的数据一览表都总结了该电路板材的各项参数。他们描述的是PCB板材的电气与机械性能,包括相对介电常数、介质损耗、热膨胀系数,以及热导率。
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控制共面传输线内的导体损耗

2013-7-19
微波电路设计者往往不仅要选择不同的设计和基材,还要选择传输线形式。带状线对于某些元件和电路而言有其自身的优势,而带状线则常用于有源和无源微波电路。但是,什么时候选择共面传输线呢?
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传输线建模工具:免费下载软件

2013-5-22
MWI-2010微波阻抗计算器软件不会取代成熟的建模工具套件,比如,安捷伦科技公司(Agilent Technologies)的高级设计系统(ADS),或AWR的Microwave Office。
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微带线与带状线:如何做出选择

2013-3-19
该用微带线还是带状线?这是高频设计师几十年来一直面临的抉择。
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薄型材料有助于实现高频应用

2013-1-9
对于移动和便携式电子终端,更加纤薄的印刷电路板(PCB)材料的机械特性在保持轻薄设计方面,拥有一些显而易见的优势。但是,使用薄层压板,需要考虑诸多事项,因为介质材料的厚度会影响诸如50欧姆线等高频应用中常用的阻抗控制线的导体厚度。在选择薄型PCB层压板材料,以实现更加轻薄的电路设计之前,对目前市场上的各类薄型层压板材料及其关键特性,以及这些层压板材料在实际的制造和应用环境中的性能,作一番审视和比较,将大有裨益。
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为印刷电路天线选择适当的基材

2012-10-9
印刷电路天线必须在小巧的封装内提供强大的性能,特别是对于现代的固定及移动无线终端。某些情况下,印刷电路天线必须提供高增益、轻重量或者处理很高的功率电平。电路板层压板材料的选择,对印刷电路天线的尺寸和性能有十分重要的影响,如在射频和微波频段上实现最高增益。
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理解介电常数的真正涵义

2012-7-17
介电常数(又称相对电容率)是一个设计工程师经常用到的参数,虽然往往并不甚解其意。每种材料都有其介电常数,就连空气也不例外(略高于一个单位)。一般而言,电路设计师将这个参数用于比较不同的印刷电路板(PCB)材料。通常情况下,是以产品数据表上列出的特定频率条件下的固定值为参照。
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哪些应用更适于使用高频层压板,而不是FR-4?

2012-7-17
基于环氧树脂的FR-4电路板材料已被广泛用于多种类型的电子应用。这是明智之举,因为这些玻璃纤维编织布基材非常可靠,而且成本低廉,人们十分了解其机械和电气特性。从音频电路到微波设计,到处都能见到这种材料的身影。但是,出于多种原因,这种材料并不适用于某些电路,特别是各式各样的高频设计。
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pathindle_forblog

Pat Hindle, 《微波杂志》主编

Pat Hindle负责《微波杂志》及其网站的内容编辑、文章审查和特别行业报道。他还负责这份杂志的社会媒体营销。加入《微波杂志》之前,Hindle先生曾在整个新英格兰地区担任各种技术和市场营销职务,包括M/A-COM(泰科电子)的营销传播、Alpha Industries(Skyworks)的产品/QA经理经理、Raytheon Research Division的项目经理,以及MIT的项目经理/质量工程师。Hindle先生毕业于东北大学商学院,并持有美国康奈尔大学学士学位。Engineering.
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Quick Review from Roma - EuMW 2014

2014-10-14
European Microwave Week just wrapped up in Rome last week. It was a busy event with strong attendance this year despite the awkward location of the venue which is far from the city and hotels. Keysight, R&S and National Instruments were front and center at the exhibition along with a large presence from companies like Anritsu, CST, ANSYS, TriQuint, Macom, Maury and Cascade to name a few. Selex Finmeccanica also had a large booth to support the show in locally in Italy. The booth traffic was strong by almost all accounts and exhibitors seemed to have good quality leads from the event.
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It's Show Time

2014-10-2
The busiest month of the year for RF/microwave industry trade shows has just started. First up is European Microwave Week (EuMW) taking place Oct 5-10 in Rome. It includes 3 conferences; the European Microwave Conference, European Radar Conference and European Microwave Integrated Circuits Conference. This is the largest microwave trade show outside of North America.
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Fall Time Update

pulse decay time or seasonal time of the year
2014-8-29
As merger mania has hit the RF industry, we head into the fall season and back to school. We had a slow end of the summer for webinars and trade shows but Sept kicks off with Autotest and Super Mobility Week plus we have a bunch of webinars coming up on a variety of topics. On the editorial side we have the following upcoming articles and themes.
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Gina Bonini

Tek Talk

Gina Bonini is a worldwide technical marketing manager for Tektronix. She has worked extensively in various test and measurement positions for over 15 years, including product planning, product marketing, and business and market development. She holds a BSChE from the University of California, Berkeley and a MSEE from Stanford University.  She along with other experts from Tektronix blog about various T&M subjects.

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Practical test needs trump instrument silos

2012-10-29
Justin PanzerWireless communications industry veteran Justin Panzer brings his insights to this edition of the Tek Talk blog. He has more than 19 years of industry experience, including 10 years in test and measurement working on everything from commercial handset testing to mil/gov RF. He is currently business development director for the Sources & Analyzers Product Line at Tektronix. He holds a Bachelor of Science from Drexel University and an MBA from Auburn University.
Ubiquity of wireless communications is adding an RF component to electronics designs that haven’t historically been wireless enabled. More complex chip, board and embedded systems designs that incorporate communications technologies into everything from PCs to automobiles are changing the impact of RF on the world's R&D engineers. Designers today need the tools to get the most out of unfamiliar technologies.
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The Diagnostic Powers of Test

2012-9-22
HendrenBrian Hendren, Senior RF and Microwave Applications Engineer, Tektronix Component Solutions takes over the Tek Talk blog and discusses prototyping for success:
In this day and age manufacturers are trying to drive costs out of every aspect of the production flow, and RF and microwave is no exception.  That means that every process step gets closely scrutinized. Specifically,“test” is one of the operations constantly under evaluation to understand the bare minimum needed to verify performance.  That approach is understandable because test is likely one of the most time consuming steps in the production flow, particularly when you include system set up time.  
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Prototyping for Success

2012-8-15
HendrenBrian Hendren, Senior RF and Microwave Applications Engineer, Tektronix Component Solutions takes over the Tek Talk blog and discusses prototyping for success:
The prototype phase plays a critical role in the development of advanced RF/microwave components and assemblies.  For design and process engineers, this phase is all about learning how the part performs and gaining insight for building the final product. Like many things in life, work and business, good communication is paramount to success, and it is critical that the design and process engineering teams work cohesively to capitalize on the opportunities for learning that prototyping provides.
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JW_blog

Judy Warner

Judy Warner is currently the Director of Sales and Marketing for Transline Technology, Inc. in Anaheim, CA. Judy has been in the Printed Circuit Board industry for nearly two decades. Her career began with Details, Inc. (later to become DDi). She was a Top-Producing Sales Professional for 10 years for Electroetch Circuits (later to become Tyco, then TTM). She has also spent several years as an Independent Sales Representative including time as the owner of her own Rep firm, Outsource Solutions.

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Road Trip to IMS Seattle

2013-5-29
Well, here we are less than a week away from the IMS 2013 show in Seattle. I don’t know about you, but I feel like I was in Montreal a just few months ago! All indicators seem to suggest that this will be a well-attended show—one that will feature countless technical sessions, a large and packed exhibition floor, and opportunities to connect with friends and many industry professionals.
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Drivers that Drive us Nuts

2013-5-17
You know what amazes me? Design software. Agilent, AWR, Mentor Graphics, Zuken…all of them amaze me! The power, the flexibility and the add-on tools that I often read about are truly stunning. Of course, not being a designer or engineer I am relatively easy to impress. Yet I do remember the design tools of old, and they didn’t contain a fraction of the power and features today’s tools offer. I am also amazed by the people who so deftly use these tools to design PCBs. These designers lay out boards that would have seemed like science fiction just a decade or two ago.
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Slowing down to Speed Up

2013-4-16
Its official: I have become my parents. Everything I swore I would never do or say—I do all the time. It is beyond annoying! Lately, I catch myself repeating myself, or telling the same story, to the same person…Argh! I feel the exasperation of my 16-year-old-alter-ego rolling her eyes and sighing hopelessly. That being said, I’m about to do it again and you will be my latest victim. Sorry. I guess now I understand what my folks meant when they used to say “some things bear repeating.”
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Sherry Hess

AWR Expert Blog

Sherry Hess is vice president of marketing at AWR, bringing with her more than 15 years of EDA experience in domestic and international sales, marketing, support, and managerial expertise. For the majority of her career Sherry served in various positions at Ansoft Corporation including director of European operations and later as vice president of marketing. Before joining Ansoft, Sherry spent two years with Intel Corporation, where she worked in the ASIC Group and developed relationships with companies such as Bell Northern Research and Northern Telecom. Sherry holds a BSEE and an MBA from Carnegie Mellon University in Pittsburgh, Pennsylvania, USA. www.awrcorp.com.

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Microwave & RF Engineers…Communication is Key!

2013-5-1

I recently agreed to co-chair the IEEE MTT-S Women in Engineering (WIE) / Women in Microwaves (WIM) organization. I have long been an advocate for advancing the cause of women in the world of RF and microwave engineering, actually back to my college days at Carnegie Mellon University (CMU) when I was one of only eight women in my EE graduating class of 110. Things have not improved much since then with women representing only 10 percent of the engineers in the U.S. today. Asia and Europe fair far better with approximately 40 percent and 20 percent respectively.


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Khan Academy- I’m a fan

2012-11-30

A few months ago, I heard a news program on NPR about the Khan Academyand how it was started accidentally by Mr. Khan to help his niece with her math homework. Since he lived far away from her, he captured his helpful hints via YouTube and shared via the Internet. One thing led to another and now Khan has found himself the creator of something big.


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RFLeonard_blog

RF Leonard Pelletier

Leonard Pelletier is the Application Support Manager for Freescale RF in Tempe, AZ and is in charge of providing technical assistance to the amplifier design community. He has been with the company since 1995 working in this position supporting any and all RF applications. Prior to his work with RF components, Mr. Pelletier held amplifier design engineering positions with both the Motorola Cellular Infrastructure Group in Arlington Heights, IL and the Motorola RF Products Division in Torrance, CA.

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Why would anyone bolt-down mount an RF device?

2011-1-27
As a member of an application-support team, we regularly write and rewrite several application notes dealing with how to mount the RF transistors for maximum RF performance. Through history, application notes such as AN1040, AN1041, AN1617, AN1673, AN1674, AN1907, AN1918, AN1923, and the latest versions of AN1949, AN3263 and AN3789, all deal with recommendations for device mounting.
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The Most Common High Power RF Design Error

2011-1-6
Here in the Freescale Application Support Department, we get lots of calls from RF design engineers, who are in a desperate, crises mode. They have created a design using the best simulation tools possible and after having just built up their first prototype units, they are having some sort RF performance issues of varying degrees. Sometimes it is poor RF performance numbers not in line with the data sheet, sometime it is spurious oscillations, or shifting RF performance numbers with temperature or maybe even, in extreme cases, total device failures.
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Three little known facts about the high-power RF products market

2011-1-6
Most people working in the high power RF design arena think that they know a fair amount about high power RF products and the devices that comprise that market space. I am here to tell you that there are three relatively interesting and unknown facts about the high power RF product market that the consumers generally do not comprehend.
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Agilent: expert to expert

A collective blog from the experts in measurement and design, discussing the latest tools for circuit-level modeling through system verification for General RF/uW, 4G Communications, and Aerospace/Defense applications. Learn about these applications and the EDA simulation software, test and measurement equipment and techniques behind state-of-the-art RF, microwave and high speed design.

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Bucking Conventional Wisdom to Boost Quality and Reliability

2013-3-12

eric_taylor_agilentEric Taylor is Vice President of Customer Experience and Quality at Agilent Technologies. He joined the company in 1992 at the former Colorado Springs Division. He held a variety of positions before being promoted to product support manager in the Electronic Measurements Division in 1997, where he worked on several cross-EMG processes, such as out-of-box defects. Over the next four years, he held several division marketing positions, including sales and business development manager for the Measurement Products Unit, and division marketing manager for the former Basic, Emerging, System Test (BEST) Division.


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A Few Thoughts While Traveling in China

2012-10-10

Todd CutlerTodd Cutler is General Manager at Agilent Technologies’ EEsof  organization, responsible for worldwide Marketing, Services, and the ESL Business. Agilent’s  EEsof EDA is the industry leader in high-frequency design software. The division’s revenue places it in the top 5 EDA companies. 

During Todd’s 30-year career, he helped found the EDA division, which began in 1986 as the computer aided engineering group within Hewlett Packard’s Test and Measurement group. In 1998, Cutler later left H-P to be CEO of Eagleware Corporation, the EDA company that pioneered the affordable Genesys RF and microwave design software. In 2005, he joined Agilent Technologies following its acquisition of Eagleware. Todd earned a BEE from Georgia Tech and an MSEE from Stanford University.

 

Todd gives us a few of his thoughts as he travels in China.


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Getting ready for one-on-one time at MTT-S IMS 2012

2012-6-15

Barry AlcornBarry is a Market Segment Manager responsible for deployment of Agilent’s broad range of RF, microwave, and digital products in the Americas. He has held this position since June of 2007.

Barry started his career in HP’s Manufacturing Test Division in 1984. He has worked as a designer in R&D, R&D Project Manager, and R&D Section Manager.  Barry has also done business development, sales support and training and been a manager for product marketing, learning products and support. He has worked in manufacturing and spent time overseas working to deploy specialized equipment into manufacturing. His industry experience spans wireless communications, automotive, aerospace defense and general manufacturing test equipment.

Barry holds a Bachelor of Science degree from Montana State University and a Master of Science from Colorado State University.


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Chris Marki

Chris Marki

While at Marki Microwave, Christopher has served as Director of Research and has been responsible for the design and commercialization of many of Marki's fastest growing product lines including filters, couplers and power dividers.

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Into the wild blog yonder…

2010-12-2
Ever since I began learning science and engineering at Duke, I was always struck with the sullen reminder that engineers are generally viewed by laymen as outcasts who know strange things and behave in even stranger ways. I’ve always hated this mischaracterization because I find, almost invariably, that scientifically minded people tend to be some of the most amazingly well rounded and talented people I know. I began writing this blog to dispel some of this bad press and to provide some “engineering-centric” content along the way. Ultimately, my goal was to provide a forum where real engineers could express their thoughts about both absurd and important scientific issues, free of the pressures of selling products and services.
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Who’s better: Tom Brady or Steve Jobs?

2010-9-16
During the World Cup, I wrote a blog entry about technology in football (i.e. soccer). Owing to the popularity of that light-hearted techno-babble and the excitement surrounding the start of the NFL regular season, I have decided to write another (silly) article about another (fruitless) pastime of mine: fantasy football. I have done a lot of thinking about fantasy football (for those of you unfamiliar, fantasy football is detailed here), and my conclusion is that it is a superior waste of time.
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A Case Against Patents

2010-8-25
People often ask me how many patents Marki Microwave owns. The answer: zero. “What? But you’re a technology company, how can this be? Aren’t you worried that someone is going to steal your idea?” Well, not really, and I will try to explain the logic behind this position. Some will read this and disagree, I have no doubt. I actually think patents do have important benefits given the right set of circumstances, but I think for small tech companies like Marki Microwave, patents do not provide as many benefits as is often assumed. I believe it is false to assume that a good idea should always be patented, here’s why…
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